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Discrete Semiconductor Products

FMP1T148

Active
Rohm Semiconductor

DIODE: SWITCHING; SMD; 80V; 80MA; 4NS; SC74A,SOT25; UFMAX: 0.9V; 80MW

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Primary product image
Discrete Semiconductor Products

FMP1T148

Active
Rohm Semiconductor

DIODE: SWITCHING; SMD; 80V; 80MA; 4NS; SC74A,SOT25; UFMAX: 0.9V; 80MW

Technical Specifications

Parameters and characteristics for this part

SpecificationFMP1T148
Current - Average Rectified (Io)25 mA
Current - Reverse Leakage @ Vr100 nA
Diode TypeSingle Phase
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-753, SC-74A
Supplier Device PackageSMD5
TechnologyStandard
Voltage - Forward (Vf) (Max) @ If [Max]900 mV
Voltage - Peak Reverse (Max) [Max]80 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2900$ 0.65
TMEN/A 1$ 0.60
10$ 0.40
100$ 0.28
500$ 0.23

Description

General part information

FMP1 Series

ROHM's switching diodes, including diode arrays, are available in high-reliability packages and stable supply for various applications.

Documents

Technical documentation and resources

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Compliance of the RoHS directive

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

How to Create Symbols for PSpice Models

Models

Two-Resistor Model for Thermal Simulation

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

Inner Structure

Package Information

Package Dimensions

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

ESD Data

Characteristics Data

FMP1 Data Sheet

Data Sheet

Anti-Whisker formation - Diodes

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Taping Information

Package Information

Explanation for Marking

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Power Loss and Thermal Design of Diodes

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

About Export Regulations

Export Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Use LTspice® Models

Schematic Design & Verification

Part Explanation

Application Note

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Diode Types and Applications

Technical Article