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28-TSSOP EP
Integrated Circuits (ICs)

EL7566AIREZ

Obsolete
Renesas Electronics Corporation

IC REG BUCK ADJ 6A 28HTSSOP

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28-TSSOP EP
Integrated Circuits (ICs)

EL7566AIREZ

Obsolete
Renesas Electronics Corporation

IC REG BUCK ADJ 6A 28HTSSOP

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationEL7566AIREZ
Current - Output6 A
Frequency - Switching [Max]1 MHz
Frequency - Switching [Min]200 kHz
FunctionStep-Down
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output ConfigurationPositive
Output TypeAdjustable
Package / CaseExposed Pad, 28-TSSOP
Package / Case [custom]4.4 mm
Package / Case [x]0.173 in
Supplier Device Package28-HTSSOP
Synchronous RectifierTrue
TopologyBuck
Voltage - Input (Max) [Max]6 V
Voltage - Input (Min) [Min]3 V
Voltage - Output (Min/Fixed)0.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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Description

General part information

EL7566 Series

The EL7566 is a full-feature synchronous step-down regulator capable of up to 6A and 96% efficiency. The device operates from 3V to 6V input supply (VIN). With internal CMOS power FETs, the device can operate at up to 100% duty ratio, allowing for an output voltage range of 0.8V to nearly VIN. An adjustable switching frequency up to 1MHz enables the use of small components, thereby reducing board area consumption to under 0.72sq-in on one side of a PCB. The EL7566 operates in constant frequency PWM mode, making external synchronization possible. A soft-start feature is integrated in the EL7566 to limit in-rush currents and allow for a smooth voltage ramp from zero to regulation. Other start-up features are integrated to add flexibility for synchronizing many supplies in multiple configurations. The EL7566 also offers a voltage margining capability that shifts the output voltage ±5% for validation of system card performance and reliability during manufacturing tests. A junction temperature indicator conveniently monitors the silicon die temperature, saving time in thermal characterization. An easy-to-use simulation tool is available for download and can be used to modify design parameters such as switching frequency, voltage ripple, ambient temperature, as well as view schematics waveforms, efficiency graphs, and complete BOM with Gerber layout.

Documents

Technical documentation and resources