50357-5036G

Obsolete

CONN HEADER HD 36POS PCB

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Connectors, Interconnects

Obsolete

CONN HEADER HD 36POS PCB

Technical Specifications

Parameters and characteristics for this part

Specification	50357-5036G

Color	Black
Connector Style	High Density (HDC, HDI, HPC)
Connector Type	Header, Male Pins
Contact Finish	GXT™, Gold or Gold
Contact Finish Thickness	0.76 Ám
Contact Finish Thickness	30 Áin
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Columns	9
Number of Positions	36
Number of Positions Loaded	All
Pitch [x]	2.54 mm
Pitch [x]	0.1 in
Termination	Solder

Part	Contact Finish Thickness	Contact Finish Thickness	Pitch [x]	Pitch [x]	Connector Type	Number of Positions Loaded	Mounting Type	Connector Style	Termination	Contact Finish	Material Flammability Rating	Number of Columns	Color	Number of Positions
Amphenol ICC (FCI) 50357-1096J	0.76 Ám	30 Áin	2.54 mm	0.1 in	Header Male Pins	All	Through Hole	High Density (HDC HDI HPC)	Solder	Gold	UL94 V-0	24	Black	96
Amphenol ICC (FCI) 50357-1112J	0.76 Ám	30 Áin	2.54 mm	0.1 in	Header Male Pins	All	Through Hole	High Density (HDC HDI HPC)	Solder	Gold	UL94 V-0	28	Black	112
Amphenol ICC (FCI) 50357-5036G	0.76 Ám	30 Áin	2.54 mm	0.1 in	Header Male Pins	All	Through Hole	High Density (HDC HDI HPC)	Solder	Gold or Gold GXT™	UL94 V-0	9	Black	36
Amphenol ICC (FCI) 50357-1168D	0.76 Ám	30 Áin	2.54 mm	0.1 in	Header Male Pins	All	Through Hole	High Density (HDC HDI HPC)	Solder	Gold	UL94 V-0	42	Black	168
Amphenol ICC (FCI) 50357-1144JLF	0.76 Ám	30 Áin	2.54 mm	0.1 in	Header Male Pins	All	Through Hole	High Density (HDC HDI HPC)	Solder	Gold	UL94 V-0	36	Black	144
Amphenol ICC (FCI) 50357-1064C	0.76 Ám	30 Áin	2.54 mm	0.1 in	Header Male Pins	All	Through Hole	High Density (HDC HDI HPC)	Solder	Gold	UL94 V-0	16	Black	64

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

36 Connector Header, Male Pins Through Hole Black High Density (HDC, HDI, HPC)

Technical documentation and resources

No documents available