Integrated Circuits (ICs)

AS4C16M16MSA-6BIN

Active

DRAM CHIP MOBILE LP SDRAM 256M-BIT 16M X 16 1.8V 54-PIN FBGA

Search across all available documentation for this part.

Integrated Circuits (ICs)

Active

DRAM CHIP MOBILE LP SDRAM 256M-BIT 16M X 16 1.8V 54-PIN FBGA

Technical Specifications

Parameters and characteristics for this part

Specification	AS4C16M16MSA-6BIN

Access Time	5.5 ns
Clock Frequency	166 MHz
Memory Format	DRAM
Memory Interface	Parallel
Memory Organization	16M x 16
Memory Size	256 Gbit
Memory Type	Volatile
Mounting Type	Surface Mount
Operating Temperature [Max]	85 C
Operating Temperature [Min]	-40 ¯C
Package / Case	54-VFBGA
Supplier Device Package	54-FBGA
Supplier Device Package [custom]	8x8
Technology	SDRAM - Mobile SDRAM
Voltage - Supply [Max]	1.95 V
Voltage - Supply [Min]	1.7 V

Part	Memory Organization	Technology	Supplier Device Package [custom]	Supplier Device Package	Voltage - Supply [Max]	Voltage - Supply [Min]	Memory Interface	Mounting Type	Clock Frequency	Memory Format	Memory Type	Memory Size	Access Time	Package / Case	Operating Temperature [Max]	Operating Temperature [Min]
Alliance Memory, Inc. AS4C16M16MSA-6BIN	16M x 16	SDRAM - Mobile SDRAM	8x8	54-FBGA	1.95 V	1.7 V	Parallel	Surface Mount	166 MHz	DRAM	Volatile	256 Gbit	5.5 ns	54-VFBGA	85 C	-40 ¯C

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

DRAM CHIP MOBILE LP SDRAM 256M-BIT 16M X 16 1.8V 54-PIN FBGA

Technical documentation and resources

No documents available