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Discrete Semiconductor Products

RX3G07BBGC16

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Rohm Semiconductor

TRANS MOSFET N-CH SI 40V 130A 3-PIN(3+TAB) TO-220AB T/R

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Search across all available documentation for this part.

DocumentsNotes for Temperature Measurement Using Forward Voltage of PN Junction PCB Layout Thermal Design Guide +37

Product dimension image

Discrete Semiconductor Products

RX3G07BBGC16

Active

Rohm Semiconductor

TRANS MOSFET N-CH SI 40V 130A 3-PIN(3+TAB) TO-220AB T/R

Deep-Dive with AI

DocumentsNotes for Temperature Measurement Using Forward Voltage of PN Junction PCB Layout Thermal Design Guide +37

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	RX3G07BBGC16

Current - Continuous Drain (Id) @ 25°C	70 A
Drain to Source Voltage (Vdss)	40 V
Drive Voltage (Max Rds On, Min Rds On)	10 V, 4.5 V
FET Type	N-Channel
Gate Charge (Qg) (Max) @ Vgs	56 nC
Input Capacitance (Ciss) (Max) @ Vds	3540 pF
Mounting Type	Through Hole
Operating Temperature	150 °C
Package / Case	TO-220-3
Rds On (Max) @ Id, Vgs	3 mOhm
Supplier Device Package	TO-220AB
Technology	MOSFET (Metal Oxide)
Vgs (Max)	20 V
Vgs(th) (Max) @ Id	2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	394	$ 3.92
Newark	Each	1	$ 4.51
		10	$ 4.17
		25	$ 2.51
		50	$ 2.39
		100	$ 2.28
		250	$ 2.08
		500	$ 1.88

Description

General part information

RX3G07BBG Series

RX3G07BBG is a power MOSFET with low on-resistance and high power small mold package, suitable for switching.

Documents

Technical documentation and resources

Notes for Temperature Measurement Using Forward Voltage of PN Junction

PCB Layout Thermal Design Guide

List of Transistor Package Thermal Resistance

About Flammability of Materials

Environmental Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

RX3G07BBG ESD Data

Characteristics Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Anti-Whisker formation - Transistors

Package Information

Two-Resistor Model for Thermal Simulation

Moisture Sensitivity Level - Transistors

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

What Is Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

TO-220AB Reliability Test Result

Manufacturing Data

Basics of Thermal Resistance and Heat Dissipation

TO-220AB Packing Information

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

About Export Regulations

Export Information

Types and Features of Transistors

Application Note

What is a Thermal Model? (Transistor)

Measurement Method and Usage of Thermal Resistance RthJC

RX3G07BBG Data Sheet

TO-220AB Dimension

Package Information

Notes for Calculating Power Consumption:Static Operation

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

TO-220AB Explanation for Marking

Package Information

Part Explanation

Application Note

TO-220AB Inner Structure

Package Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Notes for Temperature Measurement Using Thermocouples

Compliance of the RoHS directive

Environmental Data

Report of SVHC under REACH Regulation

Environmental Data

RX3G07BBG Series

Nch 40V 130A, TO-220AB, Power MOSFET

Part	Drain to Source Voltage (Vdss)	Vgs(th) (Max) @ Id	Technology	Package / Case	Gate Charge (Qg) (Max) @ Vgs	Rds On (Max) @ Id, Vgs	Vgs (Max)	Operating Temperature	Supplier Device Package	Drive Voltage (Max Rds On, Min Rds On)	Input Capacitance (Ciss) (Max) @ Vds	FET Type	Mounting Type	Current - Continuous Drain (Id) @ 25°C
Rohm Semiconductor RX3G07BBGC16	40 V	2.5 V	MOSFET (Metal Oxide)	TO-220-3	56 nC	3 mOhm	20 V	150 °C	TO-220AB	4.5 V 10 V	3540 pF	N-Channel	Through Hole	70 A