Integrated Circuits (ICs)

UPD70F3441F1(A2)-JA1-A

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IC MCU 32BIT 992KB FLSH 357LFBGA

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Integrated Circuits (ICs)

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IC MCU 32BIT 992KB FLSH 357LFBGA

Technical Specifications

Parameters and characteristics for this part

Specification	UPD70F3441F1(A2)-JA1-A

Connectivity	CSIO, UART/USART, FlexRay, CANbus
Core Processor	V850E1
Core Size	32-Bit
Data Converters	A/D 20x10b
EEPROM Size	32K x 8
Mounting Type	Surface Mount
Number of I/O	143
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Package / Case	357-LFBGA
Peripherals	RNG, PWM, WDT, DMA
Program Memory Size	992 KB
Program Memory Type	FLASH
RAM Size	60K x 8
Speed	128 MHz
Supplier Device Package	357-LFBGA (20x20)
Voltage - Supply (Vcc/Vdd) [Max]	1.65 V, 3.6 V
Voltage - Supply (Vcc/Vdd) [Min]	3 V, 1.35 V

Part	Data Converters	EEPROM Size	Core Size	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]	RAM Size	Peripherals	Speed	Core Processor	Supplier Device Package	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Package / Case	Connectivity	Number of I/O	Program Memory Type	Program Memory Size
Renesas Electronics Corporation UPD70F3441F1(A2)-JA1-A	A/D 20x10b	32K x 8	32-Bit	1.65 V 3.6 V	1.35 V 3 V	60K x 8	DMA PWM RNG WDT	128 MHz	V850E1	357-LFBGA (20x20)	125 °C	-40 °C	Surface Mount	357-LFBGA	CANbus CSIO FlexRay UART/USART	143	FLASH	992 KB

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

V850E1 V850E/PHO3 Microcontroller IC 32-Bit 128MHz 992KB (992K x 8) FLASH 357-LFBGA (20x20)

Technical documentation and resources