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SQFP52
Integrated Circuits (ICs)

BU16501KS2-E2

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Rohm Semiconductor

LED DRIVER WITH I²C COMPATIBLE AND 3-WIRE SERIAL INTERFACEFOR 8X16 LEDS IN DOT MATRIX

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SQFP52
Integrated Circuits (ICs)

BU16501KS2-E2

Active
Rohm Semiconductor

LED DRIVER WITH I²C COMPATIBLE AND 3-WIRE SERIAL INTERFACEFOR 8X16 LEDS IN DOT MATRIX

Technical Specifications

Parameters and characteristics for this part

SpecificationBU16501KS2-E2
ApplicationsSignage, Backlight
Current - Output / Channel680 mA
DimmingI2C, SPI
Frequency1.2 MHz
Internal Switch(s)True
Mounting TypeSurface Mount
Number of Outputs16
Operating Temperature [Max]85 C
Operating Temperature [Min]-40 ¯C
Package / Case52-LQFP
Supplier Device Package52-SQFP-T (10x10)
TypeLinear
Voltage - Output5.5 V
Voltage - Supply (Max) [Max]5.5 V
Voltage - Supply (Min) [Min]2.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 7.14
10$ 4.86
25$ 4.27
100$ 3.61
250$ 3.29
500$ 3.09
Digi-Reel® 1$ 7.14
10$ 4.86
25$ 4.27
100$ 3.61
250$ 3.29
500$ 3.09
N/A 1940$ 5.36
Tape & Reel (TR) 1000$ 2.93
2000$ 2.80
3000$ 2.77
NewarkEach (Supplied on Cut Tape) 1$ 7.17
10$ 4.75
25$ 4.13
50$ 3.78
100$ 3.42
250$ 3.07
500$ 2.88

Description

General part information

BU16501KS2 Series

BU16501KS2 is "Matrix LED Driver" that is the most suitable for the Home Appliance. It can control 8x16 (128 dot) LED Matrix by internal 8-channel PMOS SWs and 16-channel LED drivers. It can control the brightness in each dot by the setting of the internal register. It supports SPI and I²C interface.

Documents

Technical documentation and resources

Impact of PWM Dimming on the Conducted EMI

Technical Article

Anti-Whisker formation

Package Information

How to Use the Two-Resistor Model

Thermal Design

Compliance with the ELV directive

Environmental Data

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

UL94 Flame Classifications of Mold Compound

Environmental Data

SQFP-T52 Package Information

Package Information

ROHM Automotive Lighting Solutions

White Paper

Five Steps for Successful Thermal Design of IC

White Paper

Factory Information

Manufacturing Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

BU16501KS2 Data Sheet

Data Sheet

What Is Thermal Design

Thermal Design

Thermal Resistance

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design