Zenode.ai Logo
Beta
TSMT3
Discrete Semiconductor Products

2SCR554RTL

Active
Rohm Semiconductor

NPN, SOT-346T, 80V 1.5A, DRIVER TRANSISTOR

Deep-Dive with AI

Search across all available documentation for this part.

TSMT3
Discrete Semiconductor Products

2SCR554RTL

Active
Rohm Semiconductor

NPN, SOT-346T, 80V 1.5A, DRIVER TRANSISTOR

Technical Specifications

Parameters and characteristics for this part

Specification2SCR554RTL
Current - Collector (Ic) (Max) [Max]1.5 A
Current - Collector Cutoff (Max) [Max]1 µA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]120
Frequency - Transition300 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSC-96
Power - Max [Max]1 W
Supplier Device PackageTSMT3
Transistor TypeNPN
Vce Saturation (Max) @ Ib, Ic300 mV
Voltage - Collector Emitter Breakdown (Max) [Max]80 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.93
10$ 0.58
100$ 0.38
500$ 0.29
1000$ 0.26
Digi-Reel® 1$ 0.93
10$ 0.58
100$ 0.38
500$ 0.29
1000$ 0.26
N/A 1755$ 0.93
Tape & Reel (TR) 3000$ 0.23
6000$ 0.21
9000$ 0.20
15000$ 0.19
21000$ 0.18
30000$ 0.18
NewarkEach (Supplied on Cut Tape) 1$ 0.86
10$ 0.59
25$ 0.52
50$ 0.46
100$ 0.39
250$ 0.34
500$ 0.30
1000$ 0.27

Description

General part information

2SCR554 Series

Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.

Documents

Technical documentation and resources

TSMT3 TL Taping Spec

Datasheet

Transistor, MOSFET Flammability

Related Document

TSMT3 Part Marking

Related Document

Package Dimensions

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Export Regulations

Export Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Reliability Test Result

Manufacturing Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

What Is Thermal Design

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

2SCR554R Data Sheet

Data Sheet

How to Create Symbols for PSpice Models

Models

Two-Resistor Model for Thermal Simulation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Part Explanation

Application Note

How to Use LTspice® Models

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Inner Structure

Package Information

Anti-Whisker formation - Transistors

Package Information

Types and Features of Transistors

Application Note

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

What is a Thermal Model? (Transistor)

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

2SCR554R ESD Data

Characteristics Data

2SCR554R Thermal Resistance

Characteristics Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design