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Integrated Circuits (ICs)

BD9470AFM-GE2

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Rohm Semiconductor

WHITE LED DRIVER FOR MEDIUM SIZED AND LARGE SIZED LCD BACK LIGHT

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Integrated Circuits (ICs)

BD9470AFM-GE2

Active
Rohm Semiconductor

WHITE LED DRIVER FOR MEDIUM SIZED AND LARGE SIZED LCD BACK LIGHT

Technical Specifications

Parameters and characteristics for this part

SpecificationBD9470AFM-GE2
ApplicationsBacklight
Current - Output / Channel250 mA
DimmingPWM
Frequency150 kHz
Internal Switch(s)True
Mounting TypeSurface Mount
Number of Outputs6
Operating Temperature [Max]85 C
Operating Temperature [Min]-40 ¯C
Package / Case0.295 "
Package / Case2 Heat Tabs, 28-SOP
Package / Case7.5 mm
Supplier Device Package28-HSOP-M
TopologyStep-Up (Boost)
TypeDC DC Regulator
Voltage - Supply (Max) [Max]35 V
Voltage - Supply (Min) [Min]9 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 5.08
10$ 3.39
25$ 2.95
100$ 2.46
250$ 2.22
500$ 2.07
Digi-Reel® 1$ 5.08
10$ 3.39
25$ 2.95
100$ 2.46
250$ 2.22
500$ 2.07
N/A 0$ 3.57
Tape & Reel (TR) 1500$ 1.89
3000$ 1.80
4500$ 1.76

Description

General part information

BD9470 Series

BD9470AFM is high efficiency driver for white LED. They are designed for large sized LCD. BD9470AFM is built-in DCDC converter that supply appropriate voltage for light source. BD9470AFM is also built-in protection function for abnormal state such as OVP: over voltage protection, OCP: over current limit protection of DCDC, SCP: short circuit protection, open detection of LED string. Thus they are used for conditions of large output voltage and load conditions.

Documents

Technical documentation and resources

Impact of PWM Dimming on the Conducted EMI

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Thermal Resistance

Thermal Design

How to Use the Two-Resistor Model

Thermal Design

Five Steps for Successful Thermal Design of IC

White Paper

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Factory Information

Manufacturing Data

HSOP-M28 Package Information

Package Information

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

UL94 Flame Classifications of Mold Compound

Environmental Data

Judgment Criteria of Thermal Evaluation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Compliance with the ELV directive

Environmental Data

ROHM Automotive Lighting Solutions

White Paper

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

BD9470AFM Data Sheet

Data Sheet

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

What Is Thermal Design

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Anti-Whisker formation

Package Information