Zenode.ai Logo
Beta
INFINEON XMC1302Q024F0064ABXUMA1
Integrated Circuits (ICs)

BU91795MUF-ME2

Active
Rohm Semiconductor

LCD SEGMENT DRIVER, AEC-Q100, 105DEG C ROHS COMPLIANT: YES

Deep-Dive with AI

Search across all available documentation for this part.

INFINEON XMC1302Q024F0064ABXUMA1
Integrated Circuits (ICs)

BU91795MUF-ME2

Active
Rohm Semiconductor

LCD SEGMENT DRIVER, AEC-Q100, 105DEG C ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationBU91795MUF-ME2
Configuration48 Segment
Current - Supply12.5 µA
Display TypeLCD
GradeAutomotive
Interface2-Wire Serial
Mounting TypeSurface Mount
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-40 °C
Package / Case24-VFQFN Exposed Pad
QualificationAEC-Q100
Supplier Device PackageVQFN24FV4040
Voltage - Supply [Max]6 V
Voltage - Supply [Min]2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.51
10$ 1.35
25$ 1.28
100$ 1.09
250$ 1.02
500$ 0.90
Digi-Reel® 1$ 1.51
10$ 1.35
25$ 1.28
100$ 1.09
250$ 1.02
500$ 0.90
Tape & Reel (TR) 2500$ 0.90
NewarkEach (Supplied on Cut Tape) 1$ 2.87
10$ 1.58
25$ 1.48
50$ 1.38
100$ 1.28
250$ 1.14
500$ 1.08
1000$ 1.02

Description

General part information

BU91795MUF-M Series

BU91795MUF-M is a 1/4 duty general-purpose LCD driver that can be used for automotive applications and can drive up to 48 LCD Segments.This product can support VA LCD displays, which has better optical performance with higher LCD voltage driving and higher frame frequency driving.It can support operating temperature of up to +105℃ and is qualified for AEC-Q100 Grade2, as required for automotive applications.It has integrated display RAM for reducing CPU load. Also, it is designed with low power consumption and no external component needed.Wettable flank QFN package is suitable for small footprint applications and provides significant advantages in inspectability and solder joint reliability.