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ROHM HP8M31TB1
Discrete Semiconductor Products

HP8M31TB1

Active
Rohm Semiconductor

MOSFET, N/P-CH, 60V, 8.5A, 150DEG C, 7W ROHS COMPLIANT: YES

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ROHM HP8M31TB1
Discrete Semiconductor Products

HP8M31TB1

Active
Rohm Semiconductor

MOSFET, N/P-CH, 60V, 8.5A, 150DEG C, 7W ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationHP8M31TB1
ConfigurationN and P-Channel
Current - Continuous Drain (Id) @ 25°C8.5 A
Drain to Source Voltage (Vdss)60 V
Gate Charge (Qg) (Max) @ Vgs38 nC, 12.3 nC
Input Capacitance (Ciss) (Max) @ Vds470 pF, 2300 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerTDFN
Power - Max3 W
Rds On (Max) @ Id, Vgs65 mOhm, 70 mOhm
Supplier Device Package8-HSOP
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2473$ 2.97
NewarkEach (Supplied on Cut Tape) 1$ 2.96
10$ 2.07
25$ 1.87
50$ 1.67
100$ 1.48
250$ 1.34
500$ 1.20
1000$ 1.11

Description

General part information

HP8M31 Series

60V Nch+Pch Power MOSFET

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Compliance of the RoHS directive

Environmental Data

Taping Information

Package Information

P-channel Power MOSFETs selection guide

Technical Article

Anti-Whisker formation - Transistors

Package Information

What Is Thermal Design

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Part Explanation

Application Note

How to Create Symbols for PSpice Models

Models

Two-Resistor Model for Thermal Simulation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Inner Structure

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Package Dimensions

Package Information

HSOP8(Symmetry Dual) Condition of Soldering / Land Pattern Reference

Package Information

About Flammability of Materials

Environmental Data

About Export Regulations

Export Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

List of Transistor Package Thermal Resistance

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Explanation for Marking

Package Information

Types and Features of Transistors

Application Note

PCB Layout Thermal Design Guide

Thermal Design

HP8M31 ESD Data

Characteristics Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design