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12-VSON
Integrated Circuits (ICs)

CSD95490Q5MC

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Texas Instruments

75A SYNCHRONOUS BUCK NEXFET™ SMART POWER STAGE WITH DUALCOOL PACKAGE

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12-VSON
Integrated Circuits (ICs)

CSD95490Q5MC

Active
Texas Instruments

75A SYNCHRONOUS BUCK NEXFET™ SMART POWER STAGE WITH DUALCOOL PACKAGE

Technical Specifications

Parameters and characteristics for this part

SpecificationCSD95490Q5MC
ApplicationsSynchronous Buck Converters
Current - Output / Channel75 A
Current - Peak Output105 A
Fault ProtectionShoot-Through
FeaturesBootstrap Circuit
InterfacePWM
Load TypeCapacitive, Inductive
Mounting TypeSurface Mount
Operating Temperature [Max]125 ¯C
Operating Temperature [Min]-40 °C
Output ConfigurationHalf Bridge (3)
Package / Case12-PowerTFDFN
Supplier Device Package12-VSON-CLIP (5x6)
TechnologyPower MOSFET
Voltage - Load [Max]16 V
Voltage - Load [Min]4.5 V
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 5.83
10$ 4.89
100$ 3.96
500$ 3.52
1000$ 3.01
Digi-Reel® 1$ 5.83
10$ 4.89
100$ 3.96
500$ 3.52
1000$ 3.01
Tape & Reel (TR) 2500$ 2.84
Texas InstrumentsLARGE T&R 1$ 4.60
100$ 3.75
250$ 2.95
1000$ 2.50

Description

General part information

CSD95490Q5MC Series

The CSD95490Q5MC NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95490Q5MC NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.