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Integrated Circuits (ICs)

BD86852MUF-CE2

Active
Rohm Semiconductor

POWER MANAGEMENT IC, -40 TO 125DEG C ROHS COMPLIANT: YES

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Search across all available documentation for this part.

Documentsθ<sub>JA</sub> and Ψ<sub>JT</sub>Five Steps for Successful Thermal Design of IC+20
Product thumbnail image
Integrated Circuits (ICs)

BD86852MUF-CE2

Active
Rohm Semiconductor

POWER MANAGEMENT IC, -40 TO 125DEG C ROHS COMPLIANT: YES

Deep-Dive with AI

Documentsθ<sub>JA</sub> and Ψ<sub>JT</sub>Five Steps for Successful Thermal Design of IC+20

Technical Specifications

Parameters and characteristics for this part

SpecificationBD86852MUF-CE2
ApplicationsCamera
Current - Supply3 mA
Mounting TypeSurface Mount
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 C
Package / Case24-VFQFN Exposed Pad
Supplier Device PackageVQFN24FV4040
Voltage - Supply [Max]18 V
Voltage - Supply [Min]4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1082$ 4.19
NewarkEach (Supplied on Cut Tape) 1$ 4.66
10$ 3.04
25$ 2.91
50$ 2.80
100$ 2.67
250$ 2.43
500$ 2.18

Description

General part information

BD86852MUF-C Series

BD86852MUF-C is a power management IC with primary buck converter (DC/DC1), secondary buck converters (DC/DC2 and DC/DC3), external linear regulator control block and the power-on reset function for CMOS sensor and image sensing power supply. Output voltage and sequence are selectable and applicable to various image sensor power supply. This device adopts small package VQFN24FV4040 which is optimal for camera module. In addition, this device has a pin that can be programmed to turn on/off the spread spectrum providing a lower noise regulated outputs.