Integrated Circuits (ICs)

SN74AUC1GU04YEPR

Obsolete

IC INVERTER 1CH 1-INP 5DSBGA

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Integrated Circuits (ICs)

Obsolete

IC INVERTER 1CH 1-INP 5DSBGA

Technical Specifications

Parameters and characteristics for this part

Specification	SN74AUC1GU04YEPR

Current - Output High, Low	9 mA
Current - Quiescent (Max) [Max]	10 µA
Logic Type	Inverter
Max Propagation Delay @ V, Max CL	2.1 ns
Mounting Type	Surface Mount
Number of Circuits	1
Number of Inputs [custom]	1
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 C
Package / Case	DSBGA, 5-XFBGA
Supplier Device Package	5-DSBGA
Supplier Device Package [x]	1.4
Supplier Device Package [y]	0.9
Voltage - Supply [Max]	2.7 V
Voltage - Supply [Min]	0.8 V

Single 0.8-V to 2.7-V high speed inverter

Part	Number of Circuits	Mounting Type	Supplier Device Package	Voltage - Supply [Max]	Voltage - Supply [Min]	Number of Inputs [custom]	Current - Output High, Low	Max Propagation Delay @ V, Max CL	Package / Case	Logic Type	Operating Temperature [Max]	Operating Temperature [Min]	Current - Quiescent (Max) [Max]	Supplier Device Package [x]	Supplier Device Package [y]
Texas Instruments SN74AUC1GU04DBVR	1	Surface Mount	SOT-23-5	2.7 V	0.8 V	1	9 mA	2.1 ns	SC-74A SOT-753	Inverter	85 °C	-40 C	10 µA
Texas Instruments SN74AUC1GU04YZPR	1	Surface Mount	5-DSBGA	2.7 V	0.8 V	1	9 mA	2.1 ns	5-XFBGA DSBGA	Inverter	85 °C	-40 C	10 µA	1.4	0.9
Texas Instruments SN74AUC1GU04YEPR	1	Surface Mount	5-DSBGA	2.7 V	0.8 V	1	9 mA	2.1 ns	5-XFBGA DSBGA	Inverter	85 °C	-40 C	10 µA	1.4	0.9
Texas Instruments SN74AUC1GU04YEAR	1	Surface Mount	5-DSBGA	2.7 V	0.8 V	1	9 mA	2.1 ns	5-XFBGA DSBGA	Inverter	85 °C	-40 C	10 µA	1.4	0.9

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

This single inverter gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCCoperation.

The SN74AUC1GU04 device contains one inverter with an unbuffered output and performs the Boolean function Y =A.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Technical documentation and resources

No documents available