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TEXTISSN74LVC1G00DSF2
Integrated Circuits (ICs)

FAN5350MPX

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ON Semiconductor

3MHZ 600MA DC/DC BUCK CONVERTER IN WLCSP AND MLP PACKAGE

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TEXTISSN74LVC1G00DSF2
Integrated Circuits (ICs)

FAN5350MPX

Active
ON Semiconductor

3MHZ 600MA DC/DC BUCK CONVERTER IN WLCSP AND MLP PACKAGE

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationFAN5350MPX
Current - Output600 mA
Frequency - Switching3 MHz
FunctionStep-Down
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output ConfigurationPositive
Output Type1.81 mOhm
Supplier Device Package6-MLP (3x3)
Synchronous RectifierTrue
TopologyBuck
Voltage - Input (Max) [Max]5.5 V
Voltage - Input (Min) [Min]2.7 V
Voltage - Output (Min/Fixed)1.82 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 354$ 0.85

Description

General part information

FAN5350 Series

The FAN5350 is a step-down switching voltage regulator that delivers a fixed 1.82V from an input voltage supply of 2.7V to 5.5V. Using a proprietary architecture with synchronous rectification, the FAN5350 is capable of delivering 600mA at over 90% efficiency, while maintaining a very high efficiency of over 80% at load currents as low as 1mA. The regulator operates at a nominal fixed frequency of 3MHz at full load, which reduces the value of the external components to 1µH for the output inductor and 4.7µF for the output capacitor.At moderate and light loads, pulse frequency modulation is used to operate the device in power-save mode with a typical quiescent current of 16µA. Even with such a low quiescent current, the part exhibits excellent transient response during large load swings. At higher loads, the system automatically switches to fixed-frequency control, operating at 3MHz. In shutdown mode, the supply current drops below 1µA, reducing power consumption.The FAN5350 is available in a 6-lead Molded Leadless Package (MLP) and a 5-bump Wafer Level Chip Scale Package (WLCSP).

Documents

Technical documentation and resources