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Integrated Circuits (ICs)

THS6032CDWP

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Texas Instruments

LOW-POWER, DUAL CLASS G AMPLIFIER AND DSL/PLC LINE DRIVER

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HSOIC (DWP)
Integrated Circuits (ICs)

THS6032CDWP

Active
Texas Instruments

LOW-POWER, DUAL CLASS G AMPLIFIER AND DSL/PLC LINE DRIVER

Technical Specifications

Parameters and characteristics for this part

SpecificationTHS6032CDWP
Mounting TypeSurface Mount
Number of Drivers/Receivers [custom]0
Number of Drivers/Receivers [custom]2
Operating Temperature [Max]70 °C
Operating Temperature [Min]0 °C
Package / Case20-SOIC
Package / Case [diameter]7.5 mm
ProtocolDSL
Supplier Device Package20-HSOIC
TypeDriver
Voltage - Supply [Max]16 V
Voltage - Supply [Min]5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 75$ 13.54
Texas InstrumentsTUBE 1$ 13.78
100$ 12.04
250$ 9.28
1000$ 8.30

Description

General part information

THS6032 Series

The THS6032 is a low-power line driver ideal for asymmetrical digital subscriber line (ADSL) applications. This device contains two high-current, high-speed current-feedback drivers, which can be configured differentially for driving ADSL signals at the central office. The THS6032 features a unique class-G architecture to lower power consumption to 1.35 W. The THS6032 can also be operated in a traditional class-AB mode to reduce the number of power supplies to two.

The class-G architecture supplies current to the load from four supplies. For low output voltages (typically –2.5 < VO< +2.5), some of the output current is supplied from the +VCC(L)and –VCC(L)supplies (typically ±5 V). For large output voltages (typically VO< –2.5 and VO> +2.5), the output current is supplied from +VCC(H)and –VCC(H)(typically ±15 V). This current sharing between VCC(L)and VCC(H)minimizes power dissipation within the THS6032 output stages for high crest factor ADSL signals.

The THS6032 features a low-impedance shutdown mode, which allows the central office to receive incoming calls even after the device has been shut down. The THS6032 is available packaged in the patented PowerPAD package. This package provides outstanding thermal characteristics in a small-footprint surface-mount package, which is fully compatible with automated surface-mount assembly procedures. It is also available in the new MicroStar Junior BGA package. This package is only 25 mm2in area, allowing for high-density PCB designs.