
SN65HVD09DGGR
ActiveNINE TRANSMITTER/RECEIVER RS-422/RS-485 56-PIN TSSOP T/R
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SN65HVD09DGGR
ActiveNINE TRANSMITTER/RECEIVER RS-422/RS-485 56-PIN TSSOP T/R
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Technical Specifications
Parameters and characteristics for this part
| Specification | SN65HVD09DGGR |
|---|---|
| Duplex | Half |
| Mounting Type | Surface Mount |
| Number of Drivers/Receivers [custom] | 9 |
| Number of Drivers/Receivers [custom] | 9 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 6.1 mm |
| Package / Case | 0.24 in |
| Package / Case | 56-TFSOP |
| Protocol | RS422, RS485 |
| Receiver Hysteresis | 45 mV |
| Supplier Device Package | 56-TSSOP |
| Type | Transceiver |
| Voltage - Supply [Max] | 5.25 V |
| Voltage - Supply [Min] | 4.75 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 8.51 | |
| 10 | $ 7.69 | |||
| 25 | $ 7.33 | |||
| 100 | $ 6.37 | |||
| 250 | $ 6.08 | |||
| 500 | $ 5.54 | |||
| 1000 | $ 4.83 | |||
| Digi-Reel® | 1 | $ 8.51 | ||
| 10 | $ 7.69 | |||
| 25 | $ 7.33 | |||
| 100 | $ 6.37 | |||
| 250 | $ 6.08 | |||
| 500 | $ 5.54 | |||
| 1000 | $ 4.83 | |||
| Tape & Reel (TR) | 2000 | $ 4.65 | ||
| Texas Instruments | LARGE T&R | 1 | $ 6.52 | |
| 100 | $ 5.31 | |||
| 250 | $ 4.18 | |||
| 1000 | $ 3.54 | |||
Description
General part information
SN65HVD09-EP Series
The SN65HVD09 is a 9-channel RS-422 / RS-485 transceiver suitable for industrial applications. It offers improved switching performance, a small package, and high ESD protection. The precise skew limits ensures that the propagation delay times, not only from channel-to-channel but from device-to-device, are closely matched for the tight skew budgets associated with high-speed parallel data buses.
Patented thermal enhancements are used in the thin shrink, small-outline package (TSSOP), allowing operation over the industrial temperature range. The TSSOP package offers very small board area requirements while reducing the package height to 1 mm. This provides more board area and allows component mounting to both sides of the printed circuit boards for low-profile, space-restricted applications such as small form-factor hard disk drives.
The HVD09 can withstand electrostatic discharges exceeding 12 kV using the human-body model, and 600 V using the machine model on the RS-485 I/O terminals. This provides protection from the noise that can be coupled into external cables. The other terminals of the device can withstand discharges exceeding 4 kV and 400 V respectively.
Documents
Technical documentation and resources