Integrated Circuits (ICs)

R7F701430EABG-C#HC1

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32BIT MCU RH850/D1M2 5MB PBGA376

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Integrated Circuits (ICs)

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32BIT MCU RH850/D1M2 5MB PBGA376

Technical Specifications

Parameters and characteristics for this part

Specification	R7F701430EABG-C#HC1

Connectivity	CANbus, EBI/EMI, Ethernet, SCI, USB, SSI, UART/USART, SPI, I2C, LINbus
Core Processor	RH850G3M
Core Size	32-Bit
Data Converters	A/D 20x12b
EEPROM Size	64 K
Mounting Type	Surface Mount
Number of I/O	159
Operating Temperature [Max]	150 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	376-BGA
Peripherals	DMA, LCD, PWM, POR, LVD, I2S, WDT
Program Memory Size	5 MB
Program Memory Type	FLASH
RAM Size	512 K
Speed	240 MHz
Supplier Device Package	376-BGA (23x23)
Voltage - Supply (Vcc/Vdd) [Max]	5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	2.7 V

Part	Core Processor	Operating Temperature [Min]	Operating Temperature [Max]	Oscillator Type	Connectivity	Peripherals	Number of I/O	Program Memory Type	Program Memory Size	Supplier Device Package	Package / Case	Speed	RAM Size	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]	Data Converters	EEPROM Size	Core Size	Mounting Type
Renesas Electronics Corporation R7F701430EABG-C#HC1	RH850G3M	-40 °C	150 °C	Internal	CANbus EBI/EMI Ethernet I2C LINbus SCI SPI SSI UART/USART USB	DMA I2S LCD LVD POR PWM WDT	159	FLASH	5 MB	376-BGA (23x23)	376-BGA	240 MHz	512 K	5.5 V	2.7 V	A/D 20x12b	64 K	32-Bit	Surface Mount

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

RH850G3M RH850/D1x Microcontroller IC 32-Bit 240MHz 5MB (5M x 8) FLASH 376-BGA (23x23)

Technical documentation and resources