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Discrete Semiconductor Products

RD3L07BBGTL1

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Rohm Semiconductor

NCH 60V 115A, TO-252 (DPAK), POWER MOSFET

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Product thumbnail image
Discrete Semiconductor Products

RD3L07BBGTL1

Active
Rohm Semiconductor

NCH 60V 115A, TO-252 (DPAK), POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRD3L07BBGTL1
Current - Continuous Drain (Id) @ 25°C70 A
Drain to Source Voltage (Vdss)60 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Input Capacitance (Ciss) (Max) @ Vds2950 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)102 W
Rds On (Max) @ Id, Vgs3.9 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2171$ 3.41

Description

General part information

RD3L07BBG Series

RD3L07BBG is a power MOSFET with low on - resistance, suitable for switching.

Documents

Technical documentation and resources

Report of SVHC under REACH Regulation

Environmental Data

Condition of Soldering / Land Pattern Reference

Package Information

Types and Features of Transistors

Application Note

Two-Resistor Model for Thermal Simulation

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Package Dimensions

Package Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

About Export Regulations

Export Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

RD3L07BBG Data Sheet

Data Sheet

List of Transistor Package Thermal Resistance

Thermal Design

RD3L07BBG ESD Data

Characteristics Data

Explanation for Marking

Package Information

How to Use LTspice® Models

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Part Explanation

Application Note

TO-252_TL1 Taping Information

Package Information

Anti-Whisker formation - Transistors

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Compliance of the RoHS directive

Environmental Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Flammability of Materials

Environmental Data

What Is Thermal Design

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design