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Discrete Semiconductor Products

RE1E002SPTCL

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Rohm Semiconductor

MOSFET, P-CH, -30V, -0.25A, SC-89-3

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Search across all available documentation for this part.

Product dimension image
Discrete Semiconductor Products

RE1E002SPTCL

Active
Rohm Semiconductor

MOSFET, P-CH, -30V, -0.25A, SC-89-3

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationRE1E002SPTCL
Current - Continuous Drain (Id) @ 25°C250 mA
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeP-Channel
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-490, SC-89
Power Dissipation (Max) [Max]150 mW
Rds On (Max) @ Id, Vgs1.4 Ohm
Supplier Device PackageEMT3F (SOT-416FL)
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 9607$ 0.27
NewarkEach (Supplied on Cut Tape) 1$ 0.27
10$ 0.17
25$ 0.13
50$ 0.10
100$ 0.07
250$ 0.07
500$ 0.06
1000$ 0.06

Description

General part information

RE1E002SP Series

MOSFETs are made as ultra-low ON-resistance by the micro-processing technologies suitable for mobile equipment for low current consumption. In wide lineup including compact type, high-power type and complex type to meet in the market.

Documents

Technical documentation and resources

Reliability Test Result

Manufacturing Data

RE1E002SP Data Sheet

Data Sheet

Part Explanation

Application Note

Compliance of the RoHS directive

Environmental Data

How to Create Symbols for PSpice Models

Models

Moisture Sensitivity Level - Transistors

Package Information

Anti-Whisker formation - Transistors

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

List of Transistor Package Thermal Resistance

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Package Dimensions

Package Information

Taping Information

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

P-channel Power MOSFETs selection guide

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

ESD Data

Characteristics Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

What Is Thermal Design

Thermal Design

About Export Regulations

Export Information

Inner Structure

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Types and Features of Transistors

Application Note

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Explanation for Marking

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design