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846~TSMT8~~8
Discrete Semiconductor Products

QH8MA3TCR

Active
Rohm Semiconductor

MOSFET, N AND P-CH, 30V, 7A, TSMT

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846~TSMT8~~8
Discrete Semiconductor Products

QH8MA3TCR

Active
Rohm Semiconductor

MOSFET, N AND P-CH, 30V, 7A, TSMT

Technical Specifications

Parameters and characteristics for this part

SpecificationQH8MA3TCR
ConfigurationN and P-Channel
Current - Continuous Drain (Id) @ 25°C7 A, 5.5 A
Drain to Source Voltage (Vdss)30 V
Gate Charge (Qg) (Max) @ Vgs [Max]7.2 nC
Input Capacitance (Ciss) (Max) @ Vds300 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Power - Max [Max]1.5 W
Rds On (Max) @ Id, Vgs [Max]29 mOhm
Supplier Device PackageTSMT8
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id [Max]2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.75
10$ 0.65
100$ 0.45
500$ 0.38
1000$ 0.32
Digi-Reel® 1$ 0.75
10$ 0.65
100$ 0.45
500$ 0.38
1000$ 0.32
Tape & Reel (TR) 3000$ 0.29
6000$ 0.27
9000$ 0.26
15000$ 0.25
21000$ 0.25
NewarkEach (Supplied on Cut Tape) 1$ 0.93
10$ 0.63
25$ 0.57
50$ 0.50
100$ 0.44
250$ 0.39
500$ 0.35
1000$ 0.32

Description

General part information

QH8MA3 Series

The Middle Power MOSFET QH8MA3 is suitable for switching power supply.

Documents

Technical documentation and resources

Transistor, MOSFET Flammability

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TSMT8 TR Taping Spec

Datasheet

TSMT8 Part Marking

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QH8MA3 Data Sheet

Data Sheet

Method for Monitoring Switching Waveform

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

About Export Regulations

Export Information

Importance of Probe Calibration When Measuring Power: Deskew

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Types and Features of Transistors

Application Note

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Temperature Measurement Using Thermocouples

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Condition of Soldering / Land Pattern Reference

Package Information

Package Dimensions

Package Information

Moisture Sensitivity Level - Transistors

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What Is Thermal Design

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PCB Layout Thermal Design Guide

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Inner Structure

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Taping Information

Package Information

How to Create Symbols for PSpice Models

Models

Measurement Method and Usage of Thermal Resistance RthJC

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How to Use LTspice® Models: Tips for Improving Convergence

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List of Transistor Package Thermal Resistance

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Impedance Characteristics of Bypass Capacitor

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Two-Resistor Model for Thermal Simulation

Thermal Design

Part Explanation

Application Note

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article