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DSBGA (YZR)
Integrated Circuits (ICs)

LM3279TLX/NOPB

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Texas Instruments

BUCK-BOOST CONVERTER WITH MIPI® RFFE INTERFACE FOR 3G AND 4G RF POWER AMPLIFIERS

DSBGA (YZR)
Integrated Circuits (ICs)

LM3279TLX/NOPB

Active
Texas Instruments

BUCK-BOOST CONVERTER WITH MIPI® RFFE INTERFACE FOR 3G AND 4G RF POWER AMPLIFIERS

Technical Specifications

Parameters and characteristics for this part

SpecificationLM3279TLX/NOPB
Applications3.5G, Converter, 4G RF Power Amplifier, 3G
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-30 ░C
Package / Case16-WFBGA, DSBGA
Supplier Device Package16-DSBGA (2.5x2.12)
Voltage - Input [Max]5.5 V
Voltage - Input [Min]2.7 V
Voltage - Output [Max]4.2 V
Voltage - Output [Min]0.4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 3000$ 1.13
6000$ 1.08
Texas InstrumentsLARGE T&R 1$ 1.85
100$ 1.53
250$ 1.10
1000$ 0.83

Description

General part information

LM3279 Series

The LM3279 is a buck-boost DC/DC converter designed to generate output voltages above or below a given input voltage and is particularly suitable for Power Amplifiers operating from single-cell Li-Ion batteries in portable applications.

The LM3279 has four modes of operation: Pulse Width Modulation (PWM), Pulse Frequency Modulation (PFM), standby, and shutdown. During normal conditions, the LM3279 operates in full synchronous PWM mode at 2.4-MHz typical switching frequency, providing seamless transitions between buck and boost operating regimes. Energy-saving PFM mode increases efficiencies and current savings during low-power RF transmission modes. For high-transmit power, the device operates in PWM buck or boost mode, whereas the device can transition between PWM and PFM modes during low-power transmit. The LM3279 can be controlled either via an included MIPI RFFE Digital Control Interface or by using an analog control from an external MCU, offering design flexibility.

The power converter topology enables minimum total solution size by using one small footprint and case size inductor and two surface mount capacitors.