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HSOP8
Discrete Semiconductor Products

HP8KA1TB

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Rohm Semiconductor

MOSFET 2N-CH 30V 14A 8HSOP

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HSOP8
Discrete Semiconductor Products

HP8KA1TB

Active
Rohm Semiconductor

MOSFET 2N-CH 30V 14A 8HSOP

Technical Specifications

Parameters and characteristics for this part

SpecificationHP8KA1TB
Configuration2 N-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C14 A
Drain to Source Voltage (Vdss)30 V
FET FeatureLogic Level Gate
Gate Charge (Qg) (Max) @ Vgs24 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]2550 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerTDFN
Power - Max [Max]3 W
Rds On (Max) @ Id, Vgs5 mOhm
Supplier Device Package8-HSOP
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.77
10$ 1.12
100$ 0.75
500$ 0.59
1000$ 0.54
Digi-Reel® 1$ 1.77
10$ 1.12
100$ 0.75
500$ 0.59
1000$ 0.54
N/A 2495$ 1.76
Tape & Reel (TR) 2500$ 0.44

Description

General part information

HP8KA1 Series

The surface mount package HP8KA1 is suitable for Load Switch, LiB charging and discharging switch.

Documents

Technical documentation and resources

HSOP8 Part Marking

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Transistor, MOSFET Flammability

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HSMT8 TB Taping Spec

Datasheet

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Package Dimensions

Package Information

Types and Features of Transistors

Application Note

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

About Export Regulations

Export Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

ESD Data

Characteristics Data

PCB Layout Thermal Design Guide

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

HP8KA1 Data Sheet

Data Sheet

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Part Explanation

Application Note

How to Use LTspice® Models

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

HSOP8(Drain Common Dual) Condition of Soldering / Land Pattern Reference

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

What Is Thermal Design

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design