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ONSEMI MVGSF1N02LT1G
Discrete Semiconductor Products

BAS116HYT116

Active
Rohm Semiconductor

SMALL SIGNAL DIODE, 100V, 0.215A, SOT-23 ROHS COMPLIANT: YES

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ONSEMI MVGSF1N02LT1G
Discrete Semiconductor Products

BAS116HYT116

Active
Rohm Semiconductor

SMALL SIGNAL DIODE, 100V, 0.215A, SOT-23 ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationBAS116HYT116
Capacitance @ Vr, F4 pF
Current - Average Rectified (Io)215 mA
Current - Reverse Leakage @ Vr5 nA
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseSOT-23-3, TO-236-3, SC-59
Reverse Recovery Time (trr)3 çs
Speed [Min]200 mA, 500 ns
Supplier Device PackageSOT-23
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]80 V
Voltage - Forward (Vf) (Max) @ If1.25 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 5146$ 0.32
NewarkEach (Supplied on Cut Tape) 1$ 0.30
10$ 0.18
25$ 0.15
50$ 0.11
100$ 0.08
250$ 0.08
500$ 0.07
1000$ 0.07

Description

General part information

BAS116HY Series

BAS116HY is high reliability and low IRdiodes for general switching.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Power Loss and Thermal Design of Diodes

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Part Explanation

Application Note

Method for Monitoring Switching Waveform

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Anti-Whisker formation - Diodes

Package Information

About Flammability of Materials

Environmental Data

How to Use LTspice® Models

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Diode Types and Applications

Technical Article

About Export Regulations

Export Information

What is a Thermal Model? (Diode)

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Compliance of the RoHS directive

Environmental Data

Moisture Sensitivity Level - Diodes

Package Information

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Package Dimensions

Package Information

What Is Thermal Design

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Taping Information

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

List of Diode Package Thermal Resistance

Thermal Design