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Discrete Semiconductor Products

RF301BM2SFHTL

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Rohm Semiconductor

SUPER FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

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Product dimension image
Discrete Semiconductor Products

RF301BM2SFHTL

Active
Rohm Semiconductor

SUPER FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

Technical Specifications

Parameters and characteristics for this part

SpecificationRF301BM2SFHTL
Current - Average Rectified (Io)3 A
Current - Reverse Leakage @ Vr10 ÁA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
QualificationAEC-Q101
Reverse Recovery Time (trr)25 ns
Speed500 ns, 200 mA
Supplier Device PackageTO-252
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If930 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2159$ 0.92
NewarkEach (Supplied on Cut Tape) 1$ 1.05
10$ 0.67
25$ 0.61
50$ 0.54
100$ 0.48
300$ 0.43
500$ 0.38
1000$ 0.34

Description

General part information

RF301BM2SFH Series

RF301BM2SFH is the silicon epitaxial planar type Fast Recovery Diode.

Documents

Technical documentation and resources

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

What Is Thermal Design

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Moisture Sensitivity Level - Diodes

Package Information

Diode Types and Applications

Technical Article

Anti-Whisker formation - Diodes

Package Information

About Export Regulations

Export Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Taping Information

Package Information

Package Dimensions

Package Information

About Flammability of Materials

Environmental Data

How to Select Rectifier Diodes

Technical Article

Part Explanation

Application Note

Compliance of the RoHS directive

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

List of Diode Package Thermal Resistance

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

What is a Thermal Model? (Diode)

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Power Loss and Thermal Design of Diodes

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Inner Structure

Package Information

Explanation for Marking

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

RF301BM2SFH Data Sheet

Data Sheet

ESD Data

Characteristics Data

Reliability Test Result

Manufacturing Data

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design