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Discrete Semiconductor Products

RGTV80TK65DGVC11

NRND
Rohm Semiconductor

2ΜS SHORT-CIRCUIT TOLERANCE, 650V 23A, FRD BUILT-IN, TO-3PFM, FIELD STOP TRENCH IGBT

Product thumbnail image
Discrete Semiconductor Products

RGTV80TK65DGVC11

NRND
Rohm Semiconductor

2ΜS SHORT-CIRCUIT TOLERANCE, 650V 23A, FRD BUILT-IN, TO-3PFM, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGTV80TK65DGVC11
Current - Collector (Ic) (Max) [Max]39 A
Gate Charge81 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseTO-3PFM, SC-93-3
Power - Max [Max]85 W
Reverse Recovery Time (trr)101 ns
Supplier Device PackageTO-3PFM
Switching Energy1.02 mJ, 710 µJ
Td (on/off) @ 25°C [Max]113 ns
Td (on/off) @ 25°C [Min]39 ns
Test Condition400 V, 10 Ohm, 15 V, 40 A
Vce(on) (Max) @ Vge, Ic [Max]1.9 V
Voltage - Collector Emitter Breakdown (Max) [Max]650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 450$ 4.24
NewarkEach 1$ 4.41
10$ 3.87
25$ 3.61
50$ 3.44
100$ 3.24
250$ 3.08

Description

General part information

RGTV80TK65D Series

RGTV80TK65D is a IGBT with low collector - emitter saturation voltage, suitable for PFC, Solar Inverter, UPS, Welding, IH applications.

Documents

Technical documentation and resources

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

How to Use LTspice® Models

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Anti-Whisker formation

Package Information

Part Explanation

Application Note

Judgment Criteria of Thermal Evaluation

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What Is Thermal Design

Thermal Design

About Flammability of Materials

Environmental Data

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Types and Features of Transistors

Application Note

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Moisture Sensitivity Level

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

About Export Administration Regulations (EAR)

Export Information

Package Dimensions

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

RGTV80TK65D Data Sheet

Data Sheet

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

What is a Thermal Model? (IGBT)

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Compliance of the ELV directive

Environmental Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification