Zenode.ai Logo
Beta
RGT16NS65DGTL
Discrete Semiconductor Products

RGT16NS65DGTL

Active
Rohm Semiconductor

5ΜS SHORT-CIRCUIT TOLERANCE, 650V 8A, FRD BUILT-IN, LPDS, FIELD STOP TRENCH IGBT

Deep-Dive with AI

Search across all available documentation for this part.

RGT16NS65DGTL
Discrete Semiconductor Products

RGT16NS65DGTL

Active
Rohm Semiconductor

5ΜS SHORT-CIRCUIT TOLERANCE, 650V 8A, FRD BUILT-IN, LPDS, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGT16NS65DGTL
Current - Collector (Ic) (Max) [Max]16 A
Gate Charge21 nC
IGBT TypeTrench Field Stop
Mounting TypeSurface Mount
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263-3, TO-263AB
Power - Max [Max]94 W
Reverse Recovery Time (trr)42 ns
Supplier Device PackageLPDS
Td (on/off) @ 25°C [custom]33 ns
Td (on/off) @ 25°C [custom]13 ns
Test Condition400 V, 15 V, 10 Ohm, 8 A
Vce(on) (Max) @ Vge, Ic2.1 V
Voltage - Collector Emitter Breakdown (Max) [Max]650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 956$ 2.54

Description

General part information

RGT16NS65D(LPDS) Series

ROHM's IGBT products will contribute to energy saving high efficiency and a wide range of high voltage and high-current applications.

Documents

Technical documentation and resources

How to Create Symbols for PSpice Models

Models

How to Use LTspice® Models

Schematic Design & Verification

Part Explanation

Application Note

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

What is a Thermal Model? (IGBT)

Thermal Design

RGT16NS65D(LPDS) Data Sheet

Data Sheet

What Is Thermal Design

Thermal Design

Taping Information

Package Information

About Flammability of Materials

Environmental Data

Condition of Soldering

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

PCB Layout Thermal Design Guide

Thermal Design

Moisture Sensitivity Level

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Inner Structure

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Package Dimensions

Package Information

Inner Structure

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Compliance of the ELV directive

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Explanation for Marking

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

About Export Administration Regulations (EAR)

Export Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Types and Features of Transistors

Application Note

Anti-Whisker formation

Package Information

Reliability Test Result

Manufacturing Data

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Condition of Soldering

Package Information