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ROHM RR601BGE4STL
Discrete Semiconductor Products

RBQ10BGE10ATL

Active
Rohm Semiconductor

100V 10A, TO-252, CATHODE COMMON, LOW IRSCHOTTKY BARRIER DIODE

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ROHM RR601BGE4STL
Discrete Semiconductor Products

RBQ10BGE10ATL

Active
Rohm Semiconductor

100V 10A, TO-252, CATHODE COMMON, LOW IRSCHOTTKY BARRIER DIODE

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationRBQ10BGE10ATL
Current - Average Rectified (Io) (per Diode)10 A
Current - Reverse Leakage @ Vr80 µA
Diode Configuration1 Pair Common Cathode
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
QualificationAEC-Q101
Speed500 ns, 200 mA
Supplier Device PackageTO-252GE
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]100 V
Voltage - Forward (Vf) (Max) @ If [Max]770 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1777$ 2.25
NewarkEach (Supplied on Cut Tape) 1$ 2.30
10$ 1.55
25$ 1.39
50$ 1.24
100$ 1.08
250$ 0.97
500$ 0.86
1000$ 0.78

Description

General part information

RBQ10BGE10A Series

RBQ10BGE10A is a high reliability schottky barrier diode with low IRfor switching power supply.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Part Explanation

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Power Loss and Thermal Design of Diodes

Thermal Design

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

About Flammability of Materials

Environmental Data

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Anti-Whisker formation - Diodes

Package Information

List of Diode Package Thermal Resistance

Thermal Design

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

About Export Regulations

Export Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

RBQ10BGE10A ESD Data

Characteristics Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

How to Select Rectifier Diodes

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Diode Types and Applications

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

Judgment Criteria of Thermal Evaluation

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

How to Create Symbols for PSpice Models

Models

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

What Is Thermal Design

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Compliance of the RoHS directive

Environmental Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design