Soldering, Desoldering, Rework Products

14-0000-8053

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SOLDER SOLID WIRE AQUABOND SILVE

Soldering, Desoldering, Rework Products

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SOLDER SOLID WIRE AQUABOND SILVE

Technical Specifications

Parameters and characteristics for this part

Specification	14-0000-8053

Ag Composition	3 %
Composition Elements	Cu, Sn, Ag
Composition Formula	Sn96.5Ag3Cu0.5
Cu Composition	0.5 %
Diameter	0.093 in
Form	Spool
Form Weight	1 lb
Melting Point (Max)	495 °F
Melting Point (Min)	438 °F
Process	Lead Free
Sn Composition	96.5 %
Storage/Refrigeration Temperature (Maximum)	104 °F
Storage/Refrigeration Temperature (Minimum)	50 °F
Type	Wire Solder
Wire Gauge	11 AWG, 13 SWG

Part	Ag Composition	Composition Elements	Composition Formula	Cu Composition	Sn Composition	Process	Melting Point (Min)	Melting Point (Max)	Storage/Refrigeration Temperature (Minimum)	Storage/Refrigeration Temperature (Maximum)	Diameter	Form Weight	Form	Type	Wire Gauge
Kester Solder 14-0000-8053	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	Lead Free	438 °F	495 °F	50 °F	104 °F	0.093 in	1 lb	Spool	Wire Solder	11 AWG 13 SWG

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

Digikey	Bulk	200	$ 80.13	<6d

3D models and CAD resources for this part

General part information

Lead Free Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 11 AWG, 13 SWG Spool, 1 lb (454 g)

Technical documentation and resources