Connectors, Interconnects

TCC03DKSN-S1713

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CONN TRANSIST TO-262 3POS GOLD

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Connectors, Interconnects

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CONN TRANSIST TO-262 3POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	TCC03DKSN-S1713

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Post	30 µin
Contact Finish Thickness - Post	0.76 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	30 mOhm
Current Rating (Amps)	3 A
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	3
Operating Temperature [Max]	175 °C
Operating Temperature [Min]	-50 °C
Pitch - Mating	0.15 in
Pitch - Mating	3.81 mm
Pitch - Post [x]	0.15 in
Pitch - Post [x]	3.81 mm
Termination	Solder
Type	Transistor, TO-262

Part	Contact Resistance	Current Rating (Amps)	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post [x]	Pitch - Post [x]	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Mounting Type	Pitch - Mating	Pitch - Mating	Type	Number of Positions or Pins (Grid)	Contact Material - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Mating
Sullins Connector Solutions TCC03DKSN-S1713	30 mOhm	3 A	Solder	0.76 Ám	30 Áin	0.15 in	3.81 mm	Beryllium Copper	30 µin	0.76 µm	Gold	Through Hole	0.15 in	3.81 mm	Transistor TO-262	3	Beryllium Copper	-50 °C	175 °C	Gold

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

3 (Rectangular) Pos Transistor, TO-262 Socket Gold Through Hole

Technical documentation and resources