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TPS659102A1RSLR

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Texas Instruments

INTEGRATED POWER MANAGEMENT IC (PMIC) W/ 4 DC/DCS, 8 LDOS AND RTC IN 6X6MM QFN FAMILY

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VQFN (RSL)
Integrated Circuits (ICs)

TPS659102A1RSLR

Active
Texas Instruments

INTEGRATED POWER MANAGEMENT IC (PMIC) W/ 4 DC/DCS, 8 LDOS AND RTC IN 6X6MM QFN FAMILY

Technical Specifications

Parameters and characteristics for this part

SpecificationTPS659102A1RSLR
ApplicationsHandheld/Mobile Devices, OMAP™
Mounting TypeSurface Mount
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case48-VFQFN Exposed Pad
Supplier Device Package48-VQFN (6x6)
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]1.7 V

TPS659102 Series

Integrated Power Management IC (PMIC) w/ 4 DC/DCs, 8 LDOs and RTC in 6x6mm QFN family

PartPackage / CaseMounting TypeApplicationsOperating Temperature [Max]Operating Temperature [Min]Supplier Device PackageVoltage - Supply [Max]Voltage - Supply [Min]
VQFN (RSL)
Texas Instruments
48-VFQFN Exposed Pad
Surface Mount
Handheld/Mobile Devices
OMAP™
85 °C
-40 °C
48-VQFN (6x6)
5.5 V
1.7 V
48-VQFN-RSL
Texas Instruments
48-VFQFN Exposed Pad
Surface Mount
Handheld/Mobile Devices
OMAP™
85 °C
-40 °C
48-VQFN (6x6)
5.5 V
1.7 V
48-VQFN-RSL
Texas Instruments
48-VFQFN Exposed Pad
Surface Mount
Handheld/Mobile Devices
OMAP™
85 °C
-40 °C
48-VQFN (6x6)
5.5 V
1.7 V
48-VQFN-RSL
Texas Instruments
48-VFQFN Exposed Pad
Surface Mount
Handheld/Mobile Devices
OMAP™
85 °C
-40 °C
48-VQFN (6x6)
5.5 V
1.7 V
VQFN (RSL)
Texas Instruments
48-VFQFN Exposed Pad
Surface Mount
Handheld/Mobile Devices
OMAP™
85 °C
-40 °C
48-VQFN (6x6)
5.5 V
1.7 V
48-VQFN-RSL
Texas Instruments
48-VFQFN Exposed Pad
Surface Mount
Handheld/Mobile Devices
OMAP™
85 °C
-40 °C
48-VQFN (6x6)
5.5 V
1.7 V
48-VQFN-RSL
Texas Instruments
48-VFQFN Exposed Pad
Surface Mount
Handheld/Mobile Devices
OMAP™
85 °C
-40 °C
48-VQFN (6x6)
5.5 V
1.7 V
VQFN (RSL)
Texas Instruments
48-VFQFN Exposed Pad
Surface Mount
Handheld/Mobile Devices
OMAP™
85 °C
-40 °C
48-VQFN (6x6)
5.5 V
1.7 V
48-VQFN-RSL
Texas Instruments
48-VFQFN Exposed Pad
Surface Mount
Handheld/Mobile Devices
OMAP™
85 °C
-40 °C
48-VQFN (6x6)
5.5 V
1.7 V
VQFN (RSL)
Texas Instruments
48-VFQFN Exposed Pad
Surface Mount
Handheld/Mobile Devices
OMAP™
85 °C
-40 °C
48-VQFN (6x6)
5.5 V
1.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 4.90
10$ 4.40
25$ 4.16
100$ 3.61
250$ 3.42
500$ 3.07
1000$ 2.59
Digi-Reel® 1$ 4.90
10$ 4.40
25$ 4.16
100$ 3.61
250$ 3.42
500$ 3.07
1000$ 2.59
Tape & Reel (TR) 2500$ 2.00
Texas InstrumentsLARGE T&R 1$ 3.23
100$ 2.83
250$ 1.99
1000$ 1.60

Description

General part information

TPS659102 Series

The TPS65910 device is an integrated power-management IC available in 48-QFN package and dedicated to applications powered by one Li-Ion or Li-Ion polymer battery cell or 3-series Ni-MH cells, or by a 5-V input; it requires multiple power rails. The device provides three step-down converters, one step-up converter, and eight LDOs and is designed to support the specific power requirements of OMAP-based applications.

Two of the step-down converters provide power for dual processor cores and are controllable by a dedicated class-3 SmartReflex interface for optimum power savings. The third converter provides power for the I/Os and memory in the system.

The device includes eight general-purpose LDOs providing a wide range of voltage and current capabilities. The LDOs are fully controllable by the I2C interface. The use of the LDOs is flexible; they are intended to be used as follows: Two LDOs are designated to power the PLL and video DAC supply rails on the OMAP-based processors, four general-purpose auxiliary LDOs are available to provide power to other devices in the system, and two LDOs are provided to power DDR memory supplies in applications requiring these memories.