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DocumentsAGFB012R24D2I3V | Datasheet

Deep-Dive with AI
DocumentsAGFB012R24D2I3V | Datasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | AGFB012R24D2I3V |
|---|---|
| Architecture | FPGA, MPU |
| Connectivity | UART/USART, MMC/SD/SDIO, EBI/EMI, I2C, SPI, Ethernet, USB OTG |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
| Number of I/O | 744 |
| Operating Temperature [Max] | 100 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 2340-BFBGA Exposed Pad |
| Peripherals | WDT, DMA |
| Primary Attributes | 1.2M, FPGA |
| RAM Size | 256 KB |
| Speed | 1.4 GHz |
| Supplier Device Package | 2340-BGA (45x42) |
Pricing
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Description
General part information
AGFB012 Series
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point System On Chip (SOC) IC Agilex F FPGA - 1.2M Logic Elements 1.4GHz 2340-BGA (45x42)
Documents
Technical documentation and resources