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HUML2020L3
Discrete Semiconductor Products

2SCR562F3TR

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Rohm Semiconductor

TRANSISTOR GP BJT NPN 30V 6A 3-PIN DFN2020 T/R

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HUML2020L3
Discrete Semiconductor Products

2SCR562F3TR

Active
Rohm Semiconductor

TRANSISTOR GP BJT NPN 30V 6A 3-PIN DFN2020 T/R

Technical Specifications

Parameters and characteristics for this part

Specification2SCR562F3TR
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce200
Frequency - Transition270 MHz
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case3-UDFN Exposed Pad
Power - Max [Max]1 W
QualificationAEC-Q101
Supplier Device PackageHUML2020L3
Transistor TypeNPN
Vce Saturation (Max) @ Ib, Ic220 mV
Voltage - Collector Emitter Breakdown (Max) [Max]30 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.22
10$ 0.77
100$ 0.50
500$ 0.39
1000$ 0.36
Digi-Reel® 1$ 1.22
10$ 0.77
100$ 0.50
500$ 0.39
1000$ 0.36
N/A 2800$ 1.21
Tape & Reel (TR) 3000$ 0.31
6000$ 0.29
9000$ 0.27
15000$ 0.26
NewarkEach (Supplied on Cut Tape) 1$ 1.19
10$ 0.75
25$ 0.67
50$ 0.59
100$ 0.50
250$ 0.45
500$ 0.40
1000$ 0.36

Description

General part information

2SCR562F3 Series

Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

What is a Thermal Model? (Transistor)

Thermal Design

Package Dimensions

Package Information

Compliance of the RoHS directive

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Part Explanation

Application Note

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Types and Features of Transistors

Application Note

Explanation for Marking

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

About Export Regulations

Export Information

Reliability Test Result

Manufacturing Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Inner Structure

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Certificate of not containing SVHC under REACH Regulation

Environmental Data

2SCR562F3 ESD Data

Characteristics Data

2SCR562F3 Thermal Resistance

Characteristics Data

How to Create Symbols for PSpice Models

Models

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information