TPSM5D1806MRDBR-ET
Active4.5-V TO 15-V INPUT, DUAL 6-A, SINGLE 12-A, OUTPUT POWER MODULE WITH -55°C OPERATING TEMPERATURE
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TPSM5D1806MRDBR-ET
Active4.5-V TO 15-V INPUT, DUAL 6-A, SINGLE 12-A, OUTPUT POWER MODULE WITH -55°C OPERATING TEMPERATURE
Technical Specifications
Parameters and characteristics for this part
| Specification | TPSM5D1806MRDBR-ET |
|---|---|
| Applications | ITE (Commercial) |
| Current - Output (Max) [Max] | 12 A |
| Features | Remote Sense, Adjustable Output |
| Mounting Type | Surface Mount |
| Number of Outputs | 1 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | 51-PowerFQFN Module |
| Size / Dimension [x] | 8 mm |
| Size / Dimension [x] | 0.31 " |
| Size / Dimension [y] | 5.5 mm |
| Size / Dimension [y] | 0.22 " |
| Size / Dimension [z] | 0.07 " |
| Size / Dimension [z] | 1.9 mm |
| Supplier Device Package | 51-BQFN |
| Supplier Device Package [x] | 8 |
| Supplier Device Package [y] | 5.5 |
| Type | Non-Isolated PoL Module |
| Voltage - Input (Max) [Max] | 15 V |
| Voltage - Input (Min) [Min] | 4.5 V |
| Voltage - Output 1 [Max] | 5.5 V |
| Voltage - Output 1 [Min] | 0.5 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tape & Reel (TR) | 2000 | $ 33.48 | |
| Texas Instruments | LARGE T&R | 1 | $ 39.78 | |
| 100 | $ 35.36 | |||
| 250 | $ 29.07 | |||
| 1000 | $ 26.00 | |||
Description
General part information
TPSM5D1806E Series
The TPSM5D1806E dual 6-A output power module is a highly integrated and flexible DC-DC power supply packaged in a compact 8-mm × 5.5-mm × 1.8-mm QFN package. The input voltage range of 4.5 V to 15 V allows conversion from a wide intermediate bus as well as standard 5-V and 12-V rails. The two 6-A outputs can be configured independently for two separate power rails or combined for a single 2-phase, 12-A output.
The low-profile, 51-pin QFN package with optimal package layout enhances thermal performance. The enhanced temperature performance of –55°C enables aerospace applications in environments such as outside cabin-mounted modules or flight control units. The package footprint has all signal pins accessible from the perimeter and large thermal pads beneath the device for simple layout and easy handling in manufacturing.
The integrated power design eliminates the loop compensation and magnetics part selection from the design process. The device offers independent enable control and power-good signal for each output. Switching frequency and phase offsetting can be configured using pin-strapping. The device also offers overcurrent and thermal shutdown protection.