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Discrete Semiconductor Products

R6509END3TL1

Active
Rohm Semiconductor

MOSFET, N-CH, 650V, 9A, TO-252 ROHS COMPLIANT: YES

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Product thumbnail image
Discrete Semiconductor Products

R6509END3TL1

Active
Rohm Semiconductor

MOSFET, N-CH, 650V, 9A, TO-252 ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationR6509END3TL1
Current - Continuous Drain (Id) @ 25°C9 A
Drain to Source Voltage (Vdss)650 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]24 nC
Input Capacitance (Ciss) (Max) @ Vds430 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)94 W
Rds On (Max) @ Id, Vgs [Max]585 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 4420$ 2.52
NewarkEach (Supplied on Cut Tape) 1$ 3.02
10$ 1.86
25$ 1.70
50$ 1.54
100$ 1.37
250$ 1.35
500$ 1.11
1000$ 1.01

Description

General part information

R6509END3 Series

The R6xxxENx series are low-noise products, Super Junction MOSFETs, that place an emphasis on ease-of-use. This series products achieve superior performance for noise-sensitive applications to reduce noise, such as audio and lighting equipment.

Documents

Technical documentation and resources

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Flammability of Materials

Environmental Data

What is a Thermal Model? (Transistor)

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Report of SVHC under REACH Regulation

Environmental Data

Reliability Test Result

Manufacturing Data

Anti-Whisker formation - Transistors

Package Information

Types and Features of Transistors

Application Note

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

R6509END3 ESD Data

Characteristics Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Package Dimensions

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

TO-252_TL1 Taping Information

Package Information

What Is Thermal Design

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Explanation for Marking

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

R6509END3 Data Sheet

Data Sheet

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

About Export Regulations

Export Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Part Explanation

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Compliance of the RoHS directive

Environmental Data