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TUMT6_TUMT6 Pkg
Discrete Semiconductor Products

US6X7TR

Active
Rohm Semiconductor

TRANS GP BJT NPN 12V 1.5A 6-PIN TUMT T/R

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TUMT6_TUMT6 Pkg
Discrete Semiconductor Products

US6X7TR

Active
Rohm Semiconductor

TRANS GP BJT NPN 12V 1.5A 6-PIN TUMT T/R

Technical Specifications

Parameters and characteristics for this part

SpecificationUS6X7TR
Current - Collector (Ic) (Max) [Max]1.5 A
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]270
Frequency - Transition400 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case6-SMD, Flat Leads
Power - Max [Max]400 mW
Supplier Device PackageTUMT6
Transistor Type2 NPN (Dual)
Vce Saturation (Max) @ Ib, Ic200 mV
Voltage - Collector Emitter Breakdown (Max) [Max]12 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.57
10$ 0.49
100$ 0.34
500$ 0.28
1000$ 0.24
Digi-Reel® 1$ 0.57
10$ 0.49
100$ 0.34
500$ 0.28
1000$ 0.24
N/A 2063$ 0.95
Tape & Reel (TR) 3000$ 0.19

Description

General part information

US6X7 Series

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillattors, driver ICs and so forth.· Compact complex bipolar power transistor· For driver· Small Surface Mount Package· Pb Free/RoHS Compliant

Documents

Technical documentation and resources

How to Create Symbols for PSpice Models

Models

US6X7 ESD Data

Characteristics Data

Condition of Soldering / Land Pattern Reference

Package Information

Package Dimensions

Package Information

Moisture Sensitivity Level - Transistors

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Types and Features of Transistors

Application Note

Anti-Whisker formation - Transistors

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Part Explanation

Application Note

US6X7 Data Sheet

Data Sheet

Inner Structure

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice® Models

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Explanation for Marking

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

What Is Thermal Design

Thermal Design

Compliance of the RoHS directive

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

About Flammability of Materials

Environmental Data

About Export Regulations

Export Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Reliability Test Result

Manufacturing Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Taping Information

Package Information