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RS1G201ATTB1
Discrete Semiconductor Products

RS6R060BHTB1

Active
Rohm Semiconductor

MOSFET, N-CH, 150V, 60A, HSOP ROHS COMPLIANT: YES

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Search across all available documentation for this part.

DocumentsDatasheetHSOP8 Cu CRIP Inner Structure+36
RS1G201ATTB1
Discrete Semiconductor Products

RS6R060BHTB1

Active
Rohm Semiconductor

MOSFET, N-CH, 150V, 60A, HSOP ROHS COMPLIANT: YES

Deep-Dive with AI

DocumentsDatasheetHSOP8 Cu CRIP Inner Structure+36

Technical Specifications

Parameters and characteristics for this part

SpecificationRS6R060BHTB1
Current - Continuous Drain (Id) @ 25°C60 A
Drain to Source Voltage (Vdss)150 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 6 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]46 nC
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerTDFN
Power Dissipation (Max)104 W
Rds On (Max) @ Id, Vgs21.8 mOhm
Supplier Device Package8-HSOP
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 3.99
10$ 2.71
100$ 1.96
500$ 1.72
Digi-Reel® 1$ 3.99
10$ 2.71
100$ 1.96
500$ 1.72
N/A 4742$ 3.51
Tape & Reel (TR) 2500$ 1.12
NewarkEach (Supplied on Cut Tape) 1$ 4.12
10$ 2.91
25$ 2.86
50$ 2.48
100$ 2.08
250$ 1.90
500$ 1.72
1000$ 1.59

Description

General part information

RS6R060BH Series

RS6R060BH is a power MOSFET with low-on resistance and High power package, suitable for switching.

Documents

Technical documentation and resources

Datasheet

Datasheet

HSOP8 Cu CRIP Inner Structure

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

What Is Thermal Design

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Taping Information

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

HSOP8(TB1) Dimension

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

HSOP8(TB1) Explanation for Marking

Package Information

Anti-Whisker formation - Transistors

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

RS6R060BH ESD Data

Characteristics Data

About Flammability of Materials

Environmental Data

List of Transistor Package Thermal Resistance

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

PCB Layout Thermal Design Guide

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Part Explanation

Application Note

Compliance of the RoHS directive

Environmental Data

Condition of Soldering / Land Pattern Reference

Package Information

Report of SVHC under REACH Regulation

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Types and Features of Transistors

Application Note

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Export Regulations

Export Information

HSOP8(TB1) Taping Information

Package Information