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ROHM DTC143TETL
Discrete Semiconductor Products

RU1E002SPTCL

Active
Rohm Semiconductor

POWER MOSFET, P CHANNEL, 30 V, 250 MA, 0.9 OHM, SC-85, SURFACE MOUNT

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ROHM DTC143TETL
Discrete Semiconductor Products

RU1E002SPTCL

Active
Rohm Semiconductor

POWER MOSFET, P CHANNEL, 30 V, 250 MA, 0.9 OHM, SC-85, SURFACE MOUNT

Technical Specifications

Parameters and characteristics for this part

SpecificationRU1E002SPTCL
Current - Continuous Drain (Id) @ 25°C250 mA
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeP-Channel
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSC-85
Power Dissipation (Max)200 mW
Rds On (Max) @ Id, Vgs1.4 Ohm
Supplier Device PackageUMT3F
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 3031$ 0.27

Description

General part information

RU1E002SP Series

MOSFETs are made as ultra-low ON-resistance by the micro-processing technologies suitable for mobile equipment for low current consumption. In wide lineup including compact type, high-power type and complex type to meet in the market.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

How to Use LTspice® Models

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Moisture Sensitivity Level - Transistors

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Types and Features of Transistors

Application Note

Taping Information

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Part Explanation

Application Note

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

About Flammability of Materials

Environmental Data

P-channel Power MOSFETs selection guide

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Compliance of the RoHS directive

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Inner Structure

Package Information

ESD Data

Characteristics Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Explanation for Marking

Package Information

What Is Thermal Design

Thermal Design

Package Dimensions

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Anti-Whisker formation - Transistors

Package Information

About Export Regulations

Export Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Reliability Test Result

Manufacturing Data