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Discrete Semiconductor Products

RGTV80TS65GC13

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Rohm Semiconductor

2ΜS SHORT-CIRCUIT TOLERANCE, 650V 40A, TO-247N, FIELD STOP TRENCH IGBT

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Product dimension image
Discrete Semiconductor Products

RGTV80TS65GC13

Active
Rohm Semiconductor

2ΜS SHORT-CIRCUIT TOLERANCE, 650V 40A, TO-247N, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGTV80TS65GC13
Current - Collector (Ic) (Max) [Max]78 A
Gate Charge81 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-247-3
Power - Max [Max]234 W
Supplier Device PackageTO-247GE
Switching Energy710 µJ, 1.02 mJ
Td (on/off) @ 25°C113 ns, 39 ns
Test Condition10 Ohm, 40 A, 400 V, 15 V
Vce(on) (Max) @ Vge, Ic1.9 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 6.30
10$ 4.26
25$ 3.73
120$ 3.07
360$ 2.75
600$ 2.63
1080$ 2.51
2520$ 2.37
NewarkEach 1$ 5.21
10$ 4.38
25$ 4.13
50$ 3.84
100$ 3.55
250$ 3.35

Description

General part information

RGTV80TS65 Series

RGTV80TS65 is a IGBT with low collector - emitter saturation voltage, suitable for PFC, Solar Inverter, UPS, Welding, IH applications. The RGTV series is a product that has a good balance between low switching loss and high speed switching while guaranteeing 2μs SCSOA.

Documents

Technical documentation and resources

Datasheet

Datasheet

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

What Is Thermal Design

Thermal Design

How to Create Symbols for PSpice Models

Models

Judgment Criteria of Thermal Evaluation

Thermal Design

About Export Administration Regulations (EAR)

Export Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Moisture Sensitivity Level

Package Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Anti-Whisker formation

Package Information

Compliance of the ELV directive

Environmental Data

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Types and Features of Transistors

Application Note

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

About Flammability of Materials

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

PCB Layout Thermal Design Guide

Thermal Design