
SN74LVC1G17MDBVREP
ActiveSCHMITT TRIGGER 32MA 1 1.65V~5.5V 32MA 1 SOT-23-5 BUFFERS, DRIVERS, RECEIVERS, TRANSCEIVERS ROHS
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SN74LVC1G17MDBVREP
ActiveSCHMITT TRIGGER 32MA 1 1.65V~5.5V 32MA 1 SOT-23-5 BUFFERS, DRIVERS, RECEIVERS, TRANSCEIVERS ROHS
Technical Specifications
Parameters and characteristics for this part
| Specification | SN74LVC1G17MDBVREP |
|---|---|
| Current - Output High, Low [x] | 32 mA |
| Current - Output High, Low [y] | 32 mA |
| Input Type | Schmitt Trigger |
| Logic Type | Buffer, Non-Inverting |
| Mounting Type | Surface Mount |
| Number of Bits per Element | 1 |
| Number of Elements | 1 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Output Type | Push-Pull |
| Package / Case | SC-74A, SOT-753 |
| Supplier Device Package | SOT-23-5 |
| Voltage - Supply [Max] | 5.5 V |
| Voltage - Supply [Min] | 1.65 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 1.82 | |
| 10 | $ 1.63 | |||
| 25 | $ 1.54 | |||
| 100 | $ 1.31 | |||
| 250 | $ 1.23 | |||
| 500 | $ 1.08 | |||
| 1000 | $ 0.89 | |||
| Digi-Reel® | 1 | $ 1.82 | ||
| 10 | $ 1.63 | |||
| 25 | $ 1.54 | |||
| 100 | $ 1.31 | |||
| 250 | $ 1.23 | |||
| 500 | $ 1.08 | |||
| 1000 | $ 0.89 | |||
| Tape & Reel (TR) | 3000 | $ 0.83 | ||
| 6000 | $ 0.80 | |||
| LCSC | Piece | 1 | $ 2.44 | |
| 10 | $ 2.38 | |||
| 30 | $ 2.34 | |||
| 100 | $ 2.30 | |||
| Texas Instruments | LARGE T&R | 1 | $ 1.57 | |
| 100 | $ 1.30 | |||
| 250 | $ 0.93 | |||
| 1000 | $ 0.70 | |||
Description
General part information
SN74LVC1G17-EP Series
This single Schmitt-trigger buffer is designed for 1.65-V to 5.5-V VCCoperation.
The SN74LVC1G17 contains one buffer and performs the Boolean function Y = A. The device functions as an independent buffer, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT-) signals.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Documents
Technical documentation and resources