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Discrete Semiconductor Products

RCJ451N20TL

Active
Rohm Semiconductor

MOSFET, N-CH, 200V, 211W, TO-263S, 3PIN ROHS COMPLIANT: YES

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Product dimension image
Discrete Semiconductor Products

RCJ451N20TL

Active
Rohm Semiconductor

MOSFET, N-CH, 200V, 211W, TO-263S, 3PIN ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRCJ451N20TL
Current - Continuous Drain (Id) @ 25°C45 A
Drain to Source Voltage (Vdss)200 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]80 nC
Input Capacitance (Ciss) (Max) @ Vds4200 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263-3, TO-263AB
Power Dissipation (Max)1.56 W, 211 W
Rds On (Max) @ Id, Vgs55 mOhm
Supplier Device PackageTO-263S
TechnologyMOSFET (Metal Oxide)
Vgs (Max)30 V
Vgs(th) (Max) @ Id5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 3.71
10$ 2.47
100$ 1.95
Digi-Reel® 1$ 3.71
10$ 2.47
100$ 1.95
N/A 966$ 3.98
Tape & Reel (TR) 1000$ 1.95
NewarkEach (Supplied on Cut Tape) 1$ 4.05
10$ 2.96
25$ 2.74
50$ 2.52
100$ 2.29
250$ 2.19
500$ 2.09
1000$ 2.08

Description

General part information

RCJ451N20 Series

RCJ451N20 is a power MOSFET with low on-resistance and fast switching, suitable for the switching application.

Documents

Technical documentation and resources

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Part Explanation

Application Note

RCJ451N20 Data Sheet

Data Sheet

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Compliance of the RoHS directive

Environmental Data

Judgment Criteria of Thermal Evaluation

Thermal Design

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Export Regulations

Export Information

Types and Features of Transistors

Application Note

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

About Flammability of Materials

Environmental Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

How to Use LTspice&reg; Models

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Notes for Calculating Power Consumption:Static Operation

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design