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VQFN (RHA)
Integrated Circuits (ICs)

MSP430FR5731IRHAT

NRND
Texas Instruments

24 MHZ MCU WITH 4KB FRAM, 1KB SRAM, 10-BIT ADC, COMPARATOR, UART/SPI/I2C, TIMER

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsMigration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A)Migrating from the USCI Module to the eUSCI Module (Rev. A)+28
VQFN (RHA)
Integrated Circuits (ICs)

MSP430FR5731IRHAT

NRND
Texas Instruments

24 MHZ MCU WITH 4KB FRAM, 1KB SRAM, 10-BIT ADC, COMPARATOR, UART/SPI/I2C, TIMER

Deep-Dive with AI

DocumentsMigration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A)Migrating from the USCI Module to the eUSCI Module (Rev. A)+28

Technical Specifications

Parameters and characteristics for this part

SpecificationMSP430FR5731IRHAT
ConnectivitySCI, I2C, LINbus, SPI, UART/USART, IrDA
Core ProcessorMSP430 CPUXV2
Core Size16-Bit
Data Converters [custom]10 b
Data Converters [custom]14
Mounting TypeSurface Mount
Number of I/O32
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Oscillator TypeInternal
Package / Case40-VFQFN Exposed Pad
Program Memory Size4 KB
Program Memory TypeFRAM
RAM Size1 K
Speed24 MHz
Supplier Device Package40-VQFN (6x6)
Voltage - Supply (Vcc/Vdd) [Max]3.6 V
Voltage - Supply (Vcc/Vdd) [Min]2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.54
10$ 2.28
25$ 2.15
100$ 1.83
Digi-Reel® 1$ 2.54
10$ 2.28
25$ 2.15
100$ 1.83
Tape & Reel (TR) 250$ 1.72
500$ 1.51
1250$ 1.25
2500$ 1.16
6250$ 1.12
Texas InstrumentsSMALL T&R 1$ 1.57
100$ 1.28
250$ 1.00
1000$ 0.85

Description

General part information

MSP430FR5731 Series

The TI MSP430FR573x family of ultra-low-power microcontrollers consists of multiple devices that feature embedded FRAM nonvolatile memory, ultra-low-power 16-bit MSP430™ CPU, and different peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption. Peripherals include a 10-bit ADC, a 16-channel comparator with voltage reference generation and hysteresis capabilities, three enhanced serial channels capable of I2C, SPI, or UART protocols, an internal DMA, a hardware multiplier, an RTC, five 16-bit timers, and digital I/Os.

The TI MSP430FR573x family of ultra-low-power microcontrollers consists of multiple devices that feature embedded FRAM nonvolatile memory, ultra-low-power 16-bit MSP430™ CPU, and different peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption. Peripherals include a 10-bit ADC, a 16-channel comparator with voltage reference generation and hysteresis capabilities, three enhanced serial channels capable of I2C, SPI, or UART protocols, an internal DMA, a hardware multiplier, an RTC, five 16-bit timers, and digital I/Os.

Documents

Technical documentation and resources

Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A)

Application note

Migrating from the USCI Module to the eUSCI Module (Rev. A)

Application note

MSP430 MCUs Development Guide Book (Rev. A)

User guide

MSP430FR573x Mixed-Signal Microcontrollers datasheet (Rev. L)

Data sheet

Design Considerations When Using the MSP430 Graphics Library

Application note

Safety Manual for MSP430G2xx, F5xx, and FR57xx in IEC 60730 Safety Applications (Rev. A)

Functional safety information

MSP430 FRAM Technology – How To and Best Practices (Rev. B)

Application note

MSP430 System-Level ESD Considerations (Rev. B)

Application note

Industrial Communications Solutions Featuring MSP Microcontrollers

White paper

FRAM FAQs

White paper

System advantages of mixed signal integration

White paper

MSP430 System ESD Troubleshooting Guide

Application note

Maximizing Write Speed on the MSP430™ FRAM (Rev. B)

Application note

Crypto-Bootloader - Secure In-Field Firmware Updates for Ultra-Low Power MCUs

White paper

MSP Code Protection Features

Application note

ESD Diode Current Specification (Rev. B)

Application note

Benchmarking MCU power consumption for ultra-low-power applications

White paper

MSP430 FRAM Quality and Reliability (Rev. A)

Application note

MSP430FR57xx Family User's Guide (Rev. D)

User guide

Low-Power FRAM Microcontrollers and Their Applications

White paper

General Oversampling of MSP ADCs for Higher Resolution (Rev. A)

Application note

Power Management Solutions for Ultra-Low-Power 16-Bit MSP430 MCUs (Rev. D)

White paper

RF430FRL152H Novel Ferroelectric RAM Memory NFC Embedded Tag Based Sensors

White paper

MSP430FR5731 Microcontroller Errata (Rev. AH)

Errata

Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)

Application note

Closing the security gap with TI’s MSP430™ FRAM-based microcontrollers

White paper

Microcontrollers in Optical Networking

White paper

Migration from MSP430 FR58xx, FR59xx, and FR6xx to FR4xx and FR2xx (Rev. B)

Application note

Ultra-low power consumption MSP430FR57xx with FRAM memory

White paper

Over-the-Air (OTA) Update With the MSP430FR57xx (Rev. A)

Application note