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Integrated Circuits (ICs)
LPC5526JBD64Y
ActiveFreescale Semiconductor - NXP
IC MCU 32BIT 256KB FLASH 64TQFP
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Integrated Circuits (ICs)
LPC5526JBD64Y
ActiveFreescale Semiconductor - NXP
IC MCU 32BIT 256KB FLASH 64TQFP
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | LPC5526JBD64Y |
|---|---|
| Connectivity | Flexcomm, SPI, USB, I2C, UART/USART, MMC/SD/SDIO |
| Core Processor | ARM® Cortex®-M33 |
| Core Size | 32-Bit Single-Core |
| Data Converters [custom] | 10 channels |
| Data Converters [custom] | 16 |
| Mounting Type | Surface Mount |
| Number of I/O | 36 |
| Operating Temperature [Max] | 105 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | External, Internal |
| Package / Case | 64-TQFP Exposed Pad |
| Peripherals | WDT, POR, PWM, Brown-out Detect/Reset, DMA, I2S, RNG |
| Program Memory Size | 256 KB |
| Program Memory Type | FLASH |
| RAM Size | 144 K |
| Speed | 150 MHz |
| Supplier Device Package | 64-HTQFP (10x10) |
| Voltage - Supply (Vcc/Vdd) [Max] | 3.6 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 1.8 V |
| Part | Data Converters [custom] | Data Converters [custom] | Speed | Connectivity | Number of I/O | Program Memory Size | Peripherals | Program Memory Type | Oscillator Type | Supplier Device Package | Core Size | Package / Case | Operating Temperature [Max] | Operating Temperature [Min] | Voltage - Supply (Vcc/Vdd) [Min] | Voltage - Supply (Vcc/Vdd) [Max] | Mounting Type | RAM Size | Core Processor |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Freescale Semiconductor - NXP | 10 channels | 16 | 150 MHz | Flexcomm I2C MMC/SD/SDIO SPI UART/USART USB | 64 | 256 KB | Brown-out Detect/Reset DMA I2S POR PWM RNG WDT | FLASH | External Internal | 100-HLQFP (14x14) | 32-Bit Single-Core | 100-LQFP Exposed Pad | 105 °C | -40 °C | 1.8 V | 3.6 V | Surface Mount | 144 K | ARM® Cortex®-M33 |
Freescale Semiconductor - NXP | 10 channels | 16 | 150 MHz | Flexcomm I2C MMC/SD/SDIO SPI UART/USART USB | 36 | 256 KB | Brown-out Detect/Reset DMA I2S POR PWM RNG WDT | FLASH | External Internal | 64-HTQFP (10x10) | 32-Bit Single-Core | 64-TQFP Exposed Pad | 105 °C | -40 °C | 1.8 V | 3.6 V | Surface Mount | 144 K | ARM® Cortex®-M33 |
 Freescale Semiconductor - NXP | 10 channels | 16 | 150 MHz | Flexcomm I2C MMC/SD/SDIO SPI UART/USART USB | 64 | 256 KB | Brown-out Detect/Reset DMA I2S POR PWM RNG WDT | FLASH | External Internal | 98-VFBGA (7x7) | 32-Bit Single-Core | 98-VFBGA | 105 °C | -40 °C | 1.8 V | 3.6 V | Surface Mount | 144 K | ARM® Cortex®-M33 |
 Freescale Semiconductor - NXP | 10 channels | 16 | 150 MHz | Flexcomm I2C MMC/SD/SDIO SPI UART/USART USB | 36 | 256 KB | Brown-out Detect/Reset DMA I2S POR PWM RNG WDT | FLASH | External Internal | 64-HTQFP (10x10) | 32-Bit Single-Core | 64-TQFP Exposed Pad | 105 °C | -40 °C | 1.8 V | 3.6 V | Surface Mount | 144 K | ARM® Cortex®-M33 |
 Freescale Semiconductor - NXP | 10 channels | 16 | 150 MHz | Flexcomm I2C MMC/SD/SDIO SPI UART/USART USB | 64 | 256 KB | Brown-out Detect/Reset DMA I2S POR PWM RNG WDT | FLASH | External Internal | 98-VFBGA (7x7) | 32-Bit Single-Core | 98-VFBGA | 105 °C | -40 °C | 1.8 V | 3.6 V | Surface Mount | 144 K | ARM® Cortex®-M33 |
Freescale Semiconductor - NXP | 10 channels | 16 | 150 MHz | Flexcomm I2C MMC/SD/SDIO SPI UART/USART USB | 64 | 256 KB | Brown-out Detect/Reset DMA I2S POR PWM RNG WDT | FLASH | External Internal | 98-VFBGA (7x7) | 32-Bit Single-Core | 98-VFBGA | 105 °C | -40 °C | 1.8 V | 3.6 V | Surface Mount | 144 K | ARM® Cortex®-M33 |
 Freescale Semiconductor - NXP | 10 channels | 16 | 150 MHz | Flexcomm I2C MMC/SD/SDIO SPI UART/USART USB | 64 | 256 KB | Brown-out Detect/Reset DMA I2S POR PWM RNG WDT | FLASH | External Internal | 100-HLQFP (14x14) | 32-Bit Single-Core | 100-LQFP Exposed Pad | 105 °C | -40 °C | 1.8 V | 3.6 V | Surface Mount | 144 K | ARM® Cortex®-M33 |
Freescale Semiconductor - NXP | 10 channels | 16 | 150 MHz | Flexcomm I2C MMC/SD/SDIO SPI UART/USART USB | 64 | 256 KB | Brown-out Detect/Reset DMA I2S POR PWM RNG WDT | FLASH | External Internal | 100-HLQFP (14x14) | 32-Bit Single-Core | 100-LQFP Exposed Pad | 105 °C | -40 °C | 1.8 V | 3.6 V | Surface Mount | 144 K | ARM® Cortex®-M33 |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 5.41 | |
| 10 | $ 4.94 | |||
| 25 | $ 4.84 | |||
| 50 | $ 4.81 | |||
| 100 | $ 4.31 | |||
| 250 | $ 4.30 | |||
| 500 | $ 4.03 | |||
| Digi-Reel® | 1 | $ 5.41 | ||
| 10 | $ 4.94 | |||
| 25 | $ 4.84 | |||
| 50 | $ 4.81 | |||
| 100 | $ 4.31 | |||
| 250 | $ 4.30 | |||
| 500 | $ 4.03 | |||
| Tape & Reel (TR) | 1500 | $ 3.86 | ||
Description
General part information
LPC5526 Series
ARM® Cortex®-M33 LPC552x Microcontroller IC 32-Bit Single-Core 150MHz 256KB (256K x 8) FLASH 64-HTQFP (10x10)
Documents
Technical documentation and resources