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Discrete Semiconductor Products

BM63767S-VC

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Rohm Semiconductor

600V IGBT INTELLIGENT POWER MODULE (IPM) FOR HIGH SPEED SWITCHING DRIVE

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Search across all available documentation for this part.

Documentsθ<sub>JA</sub> and Ψ<sub>JT</sub>Method for Monitoring Switching Waveform+23
Product thumbnail image
Discrete Semiconductor Products

BM63767S-VC

Active
Rohm Semiconductor

600V IGBT INTELLIGENT POWER MODULE (IPM) FOR HIGH SPEED SWITCHING DRIVE

Deep-Dive with AI

Documentsθ<sub>JA</sub> and Ψ<sub>JT</sub>Method for Monitoring Switching Waveform+23

Technical Specifications

Parameters and characteristics for this part

SpecificationBM63767S-VC
Configuration3 Phase Inverter
Current30 A
Mounting TypeThrough Hole
TypeIGBT
Voltage600 V
Voltage - Isolation1500 VAC

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 60$ 28.32
Tube 1$ 26.90
10$ 24.81
60$ 23.69
120$ 21.19
300$ 20.21
MouserN/A 1$ 27.44
10$ 19.92
25$ 19.89
60$ 17.24

Description

General part information

BM63767S-VC Series

BM63767S-VC is an Intelligent Power Module composed of gate drivers, bootstrap diodes, IGBTs, fly wheel diodes.

Documents

Technical documentation and resources

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Compliance of the ELV directive

Environmental Data

BM63767S-VC Data Sheet

Data Sheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Anti-Whisker formation

Package Information

Constitution Materials List

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Reliability Test Result

Manufacturing Data

Judgment Criteria of Thermal Evaluation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

4 Steps for Successful Thermal Designing of Power Devices

White Paper

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

About Export Administration Regulations (EAR)

Export Information

About Flammability of Materials

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

What Is Thermal Design

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design