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41-QFN
Power Supplies - Board Mount

LMZ31503RUQT

Active
Texas Instruments

4.5V TO 15V, 3A STEP-DOWN POWER MODULE IN 9X15X2.8MM QFN PACKAGE

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41-QFN
Power Supplies - Board Mount

LMZ31503RUQT

Active
Texas Instruments

4.5V TO 15V, 3A STEP-DOWN POWER MODULE IN 9X15X2.8MM QFN PACKAGE

Technical Specifications

Parameters and characteristics for this part

SpecificationLMZ31503RUQT
ApplicationsITE (Commercial)
Control FeaturesActive High, Enable
Current - Output (Max) [Max]3 A
Efficiency93.3 %
FeaturesOTP, UVLO, OCP
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case47-BQFN Module
Size / Dimension [x]0.6 in
Size / Dimension [x]15.2 mm
Size / Dimension [y]0.36 "
Size / Dimension [y]9.2 mm
Size / Dimension [z]0.11 in
Size / Dimension [z]2.9 mm
Supplier Device Package47-B1QFN (15x9)
TypeNon-Isolated PoL Module
Voltage - Input (Min) [Min]4.5 V
Voltage - Output 1 [Max]5.5 V
Voltage - Output 1 [Min]0.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 6.19
Digi-Reel® 1$ 6.19
Tape & Reel (TR) 250$ 6.19
Texas InstrumentsSMALL T&R 1$ 9.11
100$ 7.42
250$ 5.84
1000$ 4.95

Description

General part information

LMZ31503 Series

The LMZ31503 power module is an easy-to-use integrated power solution that combines a 3-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as 3 external components and eliminates the loop compensation and magnetics design process.

The 9×15×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with up to 95% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 3-A rated output current at 85°C ambient temperature without airflow.

The LMZ31503 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.