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LITTELFUSE LJ6008D8TP
Discrete Semiconductor Products

2SAR586D3TL1

Active
Rohm Semiconductor

PNP, TO-252 (DPAK), -80V -5A, POWER TRANSISTOR

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LITTELFUSE LJ6008D8TP
Discrete Semiconductor Products

2SAR586D3TL1

Active
Rohm Semiconductor

PNP, TO-252 (DPAK), -80V -5A, POWER TRANSISTOR

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification2SAR586D3TL1
Current - Collector (Ic) (Max) [Max]5 A
Current - Collector Cutoff (Max) [Max]1 µA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]120
Frequency - Transition200 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power - Max [Max]10 W
Supplier Device PackageTO-252
Transistor TypePNP
Vce Saturation (Max) @ Ib, Ic320 mV
Voltage - Collector Emitter Breakdown (Max) [Max]80 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.22
10$ 0.99
100$ 0.77
500$ 0.66
1000$ 0.53
Digi-Reel® 1$ 1.22
10$ 0.99
100$ 0.77
500$ 0.66
1000$ 0.53
N/A 2416$ 1.81
Tape & Reel (TR) 2500$ 0.50
5000$ 0.48
12500$ 0.46
NewarkEach (Supplied on Cut Tape) 1$ 1.27
10$ 0.95
25$ 0.87
50$ 0.79
100$ 0.71
250$ 0.65
500$ 0.58
1000$ 0.53

Description

General part information

2SAR586 Series

2SAR586D3FRA is a power transistor with Low VCE(sat), suitable for low frequency amplifier.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Package Dimensions

Package Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

2SAR586D3 Data Sheet

Data Sheet

About Flammability of Materials

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

What Is Thermal Design

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

2SAR586D3 Thermal Resistance

Characteristics Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

2SAR586D3 ESD Data

Characteristics Data

List of Transistor Package Thermal Resistance

Thermal Design

About Export Regulations

Export Information

Part Explanation

Application Note

Types and Features of Transistors

Application Note

How to Use LTspice® Models

Schematic Design & Verification

Explanation for Marking

Package Information

Compliance of the RoHS directive

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

How to Create Symbols for PSpice Models

Models

TO-252_TL1 Taping Information

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Report of SVHC under REACH Regulation

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design