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Discrete Semiconductor Products

2SB1690KT146

Active
Rohm Semiconductor

PNP, SOT-346, -12V -2A, LOW VCE(SAT) TRANSISTOR

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SMT3
Discrete Semiconductor Products

2SB1690KT146

Active
Rohm Semiconductor

PNP, SOT-346, -12V -2A, LOW VCE(SAT) TRANSISTOR

Technical Specifications

Parameters and characteristics for this part

Specification2SB1690KT146
Current - Collector (Ic) (Max) [Max]2 A
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]270
Frequency - Transition360 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-3, TO-236-3, SC-59
Power - Max [Max]200 mW
Supplier Device PackageSMT3
Transistor TypePNP
Vce Saturation (Max) @ Ib, Ic180 mV
Voltage - Collector Emitter Breakdown (Max) [Max]12 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.46
10$ 0.39
100$ 0.27
500$ 0.21
1000$ 0.17
Digi-Reel® 1$ 0.46
10$ 0.39
100$ 0.27
500$ 0.21
1000$ 0.17
N/A 2513$ 0.73
Tape & Reel (TR) 3000$ 0.13

Description

General part information

2SB1690 Series

Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.

Documents

Technical documentation and resources

Transistor, MOSFET Flammability

Related Document

SMT3 Part Marking

Related Document

SMT3 T146 Taping Spec

Datasheet

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Package Dimensions

Package Information

How to Create Symbols for PSpice Models

Models

Part Explanation

Application Note

Anti-Whisker formation - Transistors

Package Information

Inner Structure

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

What Is Thermal Design

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Compliance of the RoHS directive

Environmental Data

About Export Regulations

Export Information

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

ESD Data

Characteristics Data

Moisture Sensitivity Level - Transistors

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Condition of Soldering / Land Pattern Reference

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Types and Features of Transistors

Application Note

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

2SB1690K Data Sheet

Data Sheet

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design