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ONSEMI BAS40LT1G
Discrete Semiconductor Products

BSS4130AHZGT116

Active
Rohm Semiconductor

NPN, SOT-23, 30V 1A, GENERAL PURPOSE AMPLIFICATION TRANSISTOR FOR AUTOMOTIVE

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ONSEMI BAS40LT1G
Discrete Semiconductor Products

BSS4130AHZGT116

Active
Rohm Semiconductor

NPN, SOT-23, 30V 1A, GENERAL PURPOSE AMPLIFICATION TRANSISTOR FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationBSS4130AHZGT116
Current - Collector (Ic) (Max) [Max]1 A
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]270
Frequency - Transition400 MHz
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-3, TO-236-3, SC-59
Power - Max [Max]200 mW
QualificationAEC-Q101
Supplier Device PackageSST3
Transistor TypeNPN
Vce Saturation (Max) @ Ib, Ic340 mV
Voltage - Collector Emitter Breakdown (Max) [Max]30 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 701$ 0.66
NewarkEach (Supplied on Cut Tape) 1$ 0.63
10$ 0.40
25$ 0.33
50$ 0.27
100$ 0.20
250$ 0.19
500$ 0.18
1000$ 0.18

Description

General part information

BSS4130AHZG Series

BSS4130AHZG is a SOT-23 package Transistor for low frequency amplifier, driver. This is a high-reliability product of automotive grade qualified to AEC-Q101.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Types and Features of Transistors

Application Note

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Anti-Whisker formation - Transistors

Package Information

About Export Regulations

Export Information

Compliance of the RoHS directive

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Reliability Test Result

Manufacturing Data

List of Transistor Package Thermal Resistance

Thermal Design

Package Dimensions

Package Information

PCB Layout Thermal Design Guide

Thermal Design

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Taping Information

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Explanation for Marking

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

About Flammability of Materials

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Part Explanation

Application Note