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Discrete Semiconductor Products

1SS356VMFHTE-17

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Rohm Semiconductor

35V 1.2PF, UMD2, LOW RF BAND SWITCHING DIODE FOR AUTOMOTIVE (AEC-Q101 QUALIFIED)

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Product dimension image
Discrete Semiconductor Products

1SS356VMFHTE-17

Active
Rohm Semiconductor

35V 1.2PF, UMD2, LOW RF BAND SWITCHING DIODE FOR AUTOMOTIVE (AEC-Q101 QUALIFIED)

Technical Specifications

Parameters and characteristics for this part

Specification1SS356VMFHTE-17
Capacitance @ Vr, F1.2 pF
Current - Max [Max]100 mA
Diode TypePIN - Single
GradeAutomotive
Operating Temperature150 °C
Package / CaseSC-90, SOD-323F
QualificationAEC-Q101
Resistance @ If, F900 mOhm
Supplier Device PackageUMD2
Voltage - Peak Reverse (Max) [Max]35 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2$ 0.39
NewarkEach (Supplied on Cut Tape) 1$ 0.57
10$ 0.35
25$ 0.31
50$ 0.27
100$ 0.23
250$ 0.20
500$ 0.17
1000$ 0.15

Description

General part information

1SS356VMFH Series

1SS356VMFH is a Band Switching diode with low rF, suitable for high frequency switching. This product complies with automotive qualified (AEC-Q101 Qualified).

Documents

Technical documentation and resources

Taping Information

Package Information

Moisture Sensitivity Level - Diodes

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

1SS356VMFH Data Sheet

Data Sheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

What is a Thermal Model? (Diode)

Thermal Design

Anti-Whisker formation - Diodes

Package Information

Package Dimensions

Package Information

About Flammability of Materials

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

About Export Regulations

Export Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Diode Types and Applications

Technical Article

Explanation for Marking

Package Information

Power Loss and Thermal Design of Diodes

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

Part Explanation

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Reliability Test Result

Manufacturing Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Inner Structure

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design