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RF6E045AJTCR
Discrete Semiconductor Products

RF6E045AJTCR

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Rohm Semiconductor

NCH 30V 4.5A MIDDLE POWER MOSFET

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RF6E045AJTCR
Discrete Semiconductor Products

RF6E045AJTCR

Active
Rohm Semiconductor

NCH 30V 4.5A MIDDLE POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRF6E045AJTCR
Current - Continuous Drain (Id) @ 25°C4.5 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]8.1 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]900 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case6-SMD, Flat Leads
Power Dissipation (Max) [Max]1 W
Rds On (Max) @ Id, Vgs23.7 mOhm
Supplier Device PackageTUMT6
TechnologyMOSFET (Metal Oxide)
Vgs (Max)12 V
Vgs(th) (Max) @ Id1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 4034$ 0.62
NewarkEach (Supplied on Cut Tape) 1$ 0.61
10$ 0.47
25$ 0.42
50$ 0.38
100$ 0.33
300$ 0.29
500$ 0.26
1000$ 0.23

Description

General part information

RF6E045AJ Series

Nch 30V 4.5A Middle Power MOSFET

Documents

Technical documentation and resources

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Taping Information

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Types and Features of Transistors

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

RF6E045AJ Data Sheet

Data Sheet

What is a Thermal Model? (Transistor)

Thermal Design

Inner Structure

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

About Flammability of Materials

Environmental Data

What Is Thermal Design

Thermal Design

How to Create Symbols for PSpice Models

Models

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Explanation for Marking

Package Information

Reliability Test Result

Manufacturing Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Compliance of the RoHS directive

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

ESD Data

Characteristics Data

Moisture Sensitivity Level - Transistors

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

Package Dimensions

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

About Export Regulations

Export Information

Part Explanation

Application Note